CTXS-4606S

Diode Arrays Overview

The CTXS-4606S is a high-power fast recovery diode manufactured by Sanken Electric. It features a peak reverse voltage of 600 V and an average forward current rating of 60 A. The device achieves a maximum reverse recovery time of 35 ns, optimized for low-loss operation. Typical forward voltage drop is 1.45 V at 30 A, with a maximum of 1.7 V under the same conditions. Thermal resistance from junction to case is 1.0 °C/W. The component operates within a junction temperature range of -40 °C to 150 °C.

Diode Arrays Feature Summary

• Optimized trade-off between forward voltage drop and reverse recovery time for low-noise and low-loss performance.
• Low thermal resistance package design facilitates efficient heat dissipation in high-power applications.
• Suitable for power factor correction circuits operating in both discontinuous and continuous conduction modes.

Diode Arrays Applications

• Power Factor Correction (PFC) circuits
• Large current secondary side rectifiers
• DC-DC converters

Diode Arrays Procurement Notes

Verify the specific datasheet revision before procurement, as the document indicates this part is not recommended for new designs. Confirm that the TO-3P-3L package dimensions and mounting torque requirements align with your heatsink interface specifications. Ensure storage conditions remain within standard temperature and humidity limits to prevent lead oxidation or solderability issues prior to assembly.

Diode Arrays Selection Notes

Select this component when a 600 V blocking capability and 60 A continuous current handling are required in a through-hole package. The 35 ns reverse recovery time makes it appropriate for high-frequency switching applications where minimizing switching losses is critical. Evaluate the thermal management strategy carefully, as the junction-to-case thermal resistance dictates the necessary heatsink size for maintaining safe operating temperatures under full load.

Diode Arrays Part Context

The CTXS-4606S belongs to Sanken's lineup of high-power discrete semiconductor devices designed for industrial and consumer power electronics. It utilizes a robust TO-3P-3L plastic package, which provides electrical isolation and mechanical stability for screw-mounting to heatsinks. This form factor is commonly used in applications requiring high current density and reliable thermal transfer in general-purpose electronic equipment.

Diode Arrays Replacement Considerations

Publicly confirmed substitute part numbers are not available in the provided documentation. Users should consult Sanken Electric directly for alternative recommendations or updated product lines suitable for new designs.

Diode Arrays FAQ

What is the maximum surge forward current rating?

The maximum surge forward current (IFSM) is rated at 200 A for a half-sine wave duration of one shot (10 ms).

How does the reverse leakage current change at high temperatures?

At a junction temperature of 150 °C and rated reverse voltage, the reverse leakage current increases to a maximum of 30 mA, compared to 100 µA at 25 °C.

What are the recommended screw torque values for mounting?

For the TO-3P package, the recommended screw torque is between 0.686 N·m and 0.882 N·m (7 to 9 kgf·cm).