CY7C1518KV18-250BZXC

Memory IC Overview

The CY7C1518KV18-250BZXC is a 72-Mbit synchronous pipelined SRAM featuring DDR II architecture. It offers a 4M x 18 organization with a maximum operating frequency of 250 MHz. The device utilizes a 1.8 V core power supply and supports HSTL I/O standards. It operates within an ambient temperature range of -40°C to +85°C and is housed in a 165-ball FBGA package.

Memory IC Feature Summary

• Supports two-word burst architecture for reduced address bus frequency
• Features echo clocks (CQ/CQ) to simplify data capture in high-speed systems
• Includes programmable output impedance via ZQ pin for system matching
• Integrates JTAG 1149.1 compatible Test Access Port for boundary scan

Memory IC Applications

• High-bandwidth networking equipment
• Telecommunications infrastructure
• Data acquisition systems

Memory IC Procurement Notes

Verify the specific suffix BZXC against the manufacturer's ordering guide to confirm package type and RoHS compliance status. Confirm that the 250 MHz speed grade matches the target system clock requirements. Ensure the procurement source provides valid traceability documentation for this Infineon component.

Memory IC Selection Notes

Select this part when a 72-Mbit density with 18-bit width is required. The 250 MHz speed grade suits applications needing moderate bandwidth. Consider the 165-ball FBGA footprint for PCB layout constraints. Verify compatibility with the system's 1.8 V I/O voltage levels and HSTL signaling requirements.

Memory IC Part Context

This component belongs to the CY7C1518KV18 family of DDR II SRAMs. It shares architectural features with the CY7C1520KV18, which offers a 36-bit width configuration. Both devices utilize the same 165-ball FBGA package and support similar burst architectures and clocking schemes.

Memory IC Replacement Considerations

The CY7C1518KV18-250BZI is a direct replacement offering identical electrical specifications and pinout compatibility. Verify that the substitute part maintains the same temperature range and package dimensions for seamless integration.