DF100R07W1H5FPB53BPSA1

$30.44

Description：IGBT MODULE
Series：EasyPACK™

SKU:61f5cf76837d Category: IGBT Modules Brand: Infineon Technologies

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Product introduction

Product Detailed Parameters

Description：IGBT MODULE
Series：EasyPACK™
Mfr：Infineon Technologies
Package：Bulk
IGBT Type：-
Configuration：Half Bridge Inverter
Vce(on) (Max) @ Vge, Ic：1.55V @ 15V, 25A
Input：Standard
NTC Thermistor：Yes
Operating Temperature：-40°C ~ 150°C (TJ)
Mounting Type：Chassis Mount
Package / Case：Module
Supplier Device Package：AG-EASY1B
Voltage - Collector Emitter Breakdown (Max)：650 V
Current - Collector (Ic) (Max)：40 A
Power - Max：-
Current - Collector Cutoff (Max)：40 µA
Input Capacitance (Cies) @ Vce：2.8 nF @ 25 V

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DF100R07W1H5FPB53BPSA1

Overview

The DF100R07W1H5FPB53BPSA1 is a SiC IGBT booster module from Infineon Technologies, belonging to the Trenchstop IGBT5 H5 series. It features a dual configuration with a maximum collector-emitter voltage of 650 V and a continuous collector current of 40 A at 25°C. The device exhibits a collector-emitter saturation voltage of 1.35 V and a gate-emitter leakage current of 100 nA. Designed for press-fit installation, it operates within a temperature range of -40°C to +150°C. The module utilizes CoolSiC technology and is housed in an EasyPACK package.

Feature Summary

Utilizes CoolSiC technology for enhanced power density
Features Trenchstop IGBT5 H5 architecture
Supports press-fit mounting for simplified assembly

Applications

Booster circuits in power conversion systems
High-efficiency industrial motor drives
Uninterruptible power supplies (UPS)

Procurement Notes

Verify the specific ordering suffix against official Infineon documentation to ensure correct variant selection. Confirm that the requested part number matches the exact technical specifications required for the application, as suffixes may indicate differences in packaging or testing criteria.

Selection Notes

Select this component for applications requiring high-frequency switching and low conduction losses in booster topologies. Ensure the thermal management design accommodates the specified operating temperature range and junction temperature limits defined in the official datasheet.

Part Context

This module is part of Infineon's CoolSiC portfolio, combining silicon carbide MOSFETs with IGBTs. It belongs to the EasyPACK family, designed for compact power modules. The H5 series represents advanced trench gate technology optimized for efficiency and reliability in demanding power electronics environments.

Replacement Considerations

Publicly confirmed substitute part numbers are not available in the provided source material. Consult official Infineon cross-reference tools for compatible alternatives.

How to buy

Online and offline orders are supported. If the item is available for online purchase, you can place it in the cart; for wholesale pricing, please contact our product manager for a quote.

Payment Method

Payment methods: T/T, WeChat Pay, credit cards, Google Pay, Apple Pay . Buyer covers shipping, fees, duties, and taxes; contact our product manager if you need a contract/procurement process.

Delivery time

In-stock items usually ship within 24 hours. Otherwise, shipment is arranged 1 to 2 days after the items arrive at our warehouse. Timing depends on destination and shipping method.

Freight calculation

Freight cost depends on destination, package size, and weight . We offer shipping options via DHL, FedEx, UPS, and TNT , and can ship using your freight account upon request.

Mode of Transportation

We ship via DHL, FedEx, UPS, and TNT. If you prefer a specific logistics provider, we can ship using your designated carrier.

Return and Refund

Returns are accepted within 60 days of invoice with RMA approval. Items must be resalable; original invoice and test report are required. No returns for customer errors.