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Product Detailed Parameters
- Description：EASY STANDARD
- Series：-
- Mfr：Infineon Technologies
- Package：Tray
- Technology：-
- Configuration：-
- FET Feature：-
- Drain to Source Voltage (Vdss)：-
- Current - Continuous Drain (Id) @ 25°C：-
- Rds On (Max) @ Id, Vgs：-
- Vgs(th) (Max) @ Id：-
- Gate Charge (Qg) (Max) @ Vgs：-
- Input Capacitance (Ciss) (Max) @ Vds：-
- Power - Max：-
- Operating Temperature：-
- Mounting Type：-
- Package / Case：-
- Supplier Device Package：-
- Grade：-
- Qualification：-
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Overview
The DF17MR12W1M1HFB86BPSA1 is a CoolSiC™ MOSFET booster module from Infineon Technologies, utilizing the AG-EASY1B package. It features a 1200 V voltage rating and integrates press-fit contact technology for secure mounting. The module includes an integrated negative temperature coefficient (NTC) temperature sensor for thermal monitoring. It is designed for high-performance power conversion applications requiring robust mechanical connections and advanced silicon carbide semiconductor technology.
Feature Summary
- Integrates CoolSiC™ trench MOSFET technology for efficient power switching
- Utilizes press-fit contact technology to eliminate soldering requirements
- Includes an integrated NTC temperature sensor for precise thermal management
Applications
- High-efficiency DC-DC converters
- Industrial motor drives
- Uninterruptible power supplies (UPS)
Procurement Notes
Verify the complete ordering code matches the required configuration exactly. Confirm that the AG-EASY1B package dimensions align with the target heatsink design. Ensure the assembly process adheres to the official Easy-PressFIT module installation guidelines to maintain mechanical integrity and electrical performance.
Selection Notes
Select this component when a non-soldered connection method is required for high-reliability applications. The integrated NTC sensor simplifies thermal protection circuitry design. Verify that the system voltage does not exceed the 1200 V rating and that the cooling solution supports the thermal characteristics of the AG-EASY1B package.
Part Context
This part belongs to the Infineon EasyPak family of discrete semiconductor modules. These modules are engineered to combine silicon carbide MOSFETs with convenient mounting solutions. The specific designation indicates a booster configuration within the 1200 V CoolSiC portfolio, targeting applications demanding high power density and reduced assembly complexity.
Replacement Considerations
Check for other variants within the DF17MR12 series that may offer different current ratings or package suffixes. Verify compatibility with existing PCB layouts if substituting with similar press-fit modules from the same manufacturer.
