DF200R07W2H3B77BPSA1

Overview

The DF200R07W2H3B77BPSA1 is a three-phase inverter IGBT module from the EasyPACK 2B series, utilizing Trench/Fieldstop IGBT H3 technology and rapid diodes. It features a 650 V collector-emitter voltage rating with implemented currents of 50 A for outer legs (T1/T4) and 100 A for inner legs (T2/T3). The module incorporates PressFIT contact technology and an integrated NTC thermistor. Key electrical parameters include a maximum continuous DC collector current of 40 A to 70 A depending on the leg, a repetitive peak collector current of 100 A to 200 A, and a gate-emitter peak voltage of ±20 V.

Feature Summary

• Low inductive design with low switching losses and low saturation voltage
• Aluminum oxide substrate providing low thermal resistance
• PressFIT contact technology combined with rugged mounting clamps
• Integrated NTC thermistor for temperature monitoring

Applications

• Three-level applications
• Motor drives
• Solar applications

Procurement Notes

Verify component authenticity by checking the Data Matrix barcode against Infineon standards. Confirm that the ordering suffix B77 corresponds to the specific EasyPACK 2B variant with PressFIT pins and NTC integration. Ensure the procurement documentation matches the official datasheet revision 1.00 released in November 2021.

Selection Notes

Select this module for designs requiring 650 V blocking capability with asymmetric current ratings for three-phase inverters. The PressFIT termination requires compatible PCB pads and specific insertion tools. Verify that the thermal management system can handle the junction-to-heat sink thermal resistance values provided in the datasheet tables for both IGBT and diode sections.

Part Context

This component belongs to the Infineon EasyPACK 2B family, designed for medium-power industrial applications. It utilizes Trench/Fieldstop IGBT H3 technology to optimize performance in variable speed drives. The module integrates both IGBTs and rapid recovery diodes into a single compact package suitable for high-density power electronics designs.

Replacement Considerations

Direct replacements within the same EasyPACK 2B form factor should be verified against the official replacement list. Cross-referencing with other H3 technology modules in the 650 V range is necessary to ensure compatibility with existing gate driver requirements and mechanical mounting constraints.

FAQ

What is the difference in current rating between the outer and inner legs?

The outer legs (T1/T4) have an implemented collector current of 50 A, while the inner legs (T2/T3) support a higher implemented collector current of 100 A.

How does the module achieve low inductance?

The module features a low inductive design with a specified stray inductance of 41 nH between the collector and emitter terminals.

Is the module qualified for industrial environments?

Yes, the product is qualified for industrial applications according to the relevant tests of IEC 60747, 60749, and 60068.