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Product Detailed Parameters
- Description：DFXR07P - IGBT MODULE
- Series：*
- Mfr：Infineon Technologies
- Package：Bulk
- IGBT Type：-
- Configuration：-
- Vce(on) (Max) @ Vge, Ic：-
- Input：-
- NTC Thermistor：-
- Operating Temperature：-
- Mounting Type：-
- Package / Case：-
- Supplier Device Package：-
- Voltage - Collector Emitter Breakdown (Max)：-
- Current - Collector (Ic) (Max)：-
- Power - Max：-
- Current - Collector Cutoff (Max)：-
- Input Capacitance (Cies) @ Vce：-
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Overview
The DF300R07PE4B6BOSA1 is a silicon IGBT module from Infineon Technologies, belonging to the Trench/Fieldstop IGBT - E4 series. It utilizes the EconoPACK trademark packaging and is designed for high-power applications requiring robust switching performance. The component features a specific configuration suitable for industrial power conversion systems, integrating advanced semiconductor technology within a standardized form factor to ensure reliable operation under demanding electrical conditions.
Feature Summary
- Utilizes Trench/Fieldstop IGBT technology for optimized switching characteristics
- Incorporates EconoPACK packaging design for efficient thermal management
- Built on silicon substrate for stable industrial-grade performance
Applications
- Industrial motor drives
- Uninterruptible power supplies
- Induction heating systems
Procurement Notes
Verify the exact part number against official Infineon documentation before procurement. Confirm that the B6 suffix aligns with current manufacturing specifications. Ensure compatibility with existing system requirements regarding voltage ratings and current capacities. Cross-reference with authorized distributors to validate authenticity and traceability of the component batch.
Selection Notes
Select this module when a 650V rating and 300A continuous collector current are required. Consider the EconoPACK footprint for board space constraints. Evaluate thermal resistance parameters against the heatsink design. Compare switching losses with alternative technologies if efficiency is critical. Verify gate drive compatibility with the specified IGBT family characteristics.
Part Context
This component is part of Infineon's broader portfolio of Trench/Fieldstop IGBT modules. It shares architectural similarities with other devices in the E4 series, such as the FD300R07PE4_B6. The designation indicates a specific variant within the EconoPACK line, distinguished by its internal chip configuration and packaging style intended for medium to high-power industrial applications.
Replacement Considerations
The alias SP000873426 refers to the same component. Check for direct replacements within the same EconoPACK series. Verify pinout compatibility before substituting with similar rated modules. Ensure thermal interface material requirements match the replacement device specifications.
