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Product Detailed Parameters
- Description：LOW POWER EASY
- Series：-
- Mfr：Infineon Technologies
- Package：Tray
- IGBT Type：-
- Voltage - Collector Emitter Breakdown (Max)：-
- Current - Collector (Ic) (Max)：-
- Current - Collector Pulsed (Icm)：-
- Vce(on) (Max) @ Vge, Ic：-
- Power - Max：-
- Switching Energy：-
- Input Type：-
- Gate Charge：-
- Td (on/off) @ 25°C：-
- Test Condition：-
- Reverse Recovery Time (trr)：-
- Operating Temperature：-
- Mounting Type：-
- Package / Case：-
- Supplier Device Package：-
- Grade：-
- Qualification：-
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Overview
The DF400R07W2S5FB77BPSA1 is a discrete semiconductor module manufactured by Infineon Technologies, belonging to the EasyPACK series. It utilizes silicon technology and is designed for high-power switching applications. The component features a tray packaging format with a factory pack quantity of 15 units. As part of the IGBT module category, it provides robust performance characteristics suitable for industrial power conversion systems requiring reliable semiconductor switching capabilities.
Feature Summary
- Integrated into the EasyPACK modular platform for standardized mounting
- Utilizes silicon-based semiconductor technology for power switching
- Designed as a discrete module for flexible circuit integration
Applications
- Industrial motor drives
- Power supply inverters
- General purpose AC/DC conversion
Procurement Notes
Verify the specific suffix B77 against the manufacturer's current datasheet to confirm exact electrical parameters and pinout configuration. Confirm RoHS compliance status through official documentation before procurement. Check regional sales restrictions as availability may vary by distributor location. Ensure the discrete module form factor matches the thermal management design requirements of the target application.
Selection Notes
Select this module when a discrete silicon IGBT solution within the EasyPACK footprint is required. Compare continuous collector current and saturation voltage specifications against the load requirements. Evaluate the thermal resistance characteristics relative to the available heatsinking infrastructure. Ensure the voltage rating aligns with the maximum DC bus voltage of the inverter or converter topology.
Part Context
This component belongs to Infineon's EasyPACK family, which standardizes mechanical dimensions for power modules. The DF prefix typically indicates an IGBT diode combination within a single package. The series offers a balance of performance and cost for medium to high-power applications. It serves as a core switching element in three-phase inverter bridges and other multi-leg power electronic circuits.
Replacement Considerations
Consult the official Infineon replacement guide for direct equivalents. Verify that any substitute maintains the same EasyPACK mechanical footprint and pin assignment. Ensure the replacement device meets or exceeds the original voltage and current ratings. Cross-reference thermal characteristics to guarantee compatibility with existing cooling solutions.
