DHH55-36N1F

Diode Arrays Overview

The DHH55-36N1F is a small signal switching diode manufactured by IXYS, designed for high-power applications. It features a dual configuration housed in an ISOPLUS i4-PAC-3 through-hole package. The device supports a maximum repetitive peak reverse voltage of 1.8 kV and a continuous forward current of 60 A. It exhibits a peak non-repetitive surge current capacity of 700 A and a typical reverse recovery time of 230 ns. The forward voltage drop is specified at 2.57 V under rated conditions, with a maximum reverse leakage current of 200 uA. Power dissipation reaches 210 W, operating within a temperature range of -55 C to +150 C.

Diode Arrays Feature Summary

• Dual configuration enabling series connection for high-voltage blocking requirements
• High surge current capability suitable for demanding power switching environments
• Fast recovery characteristics optimized for efficient high-frequency operation

Diode Arrays Applications

• High voltage DC-DC converters
• Induction heating systems
• Resonant tank circuits

Diode Arrays Procurement Notes

Verify the manufacturer designation against Littelfuse records following the acquisition of IXYS discrete semiconductor assets. Confirm that the specific ordering suffix matches the required electrical parameters and packaging style. Ensure compliance with RoHS and REACH SVHC regulations as documented in the official datasheet. Cross-reference the component marking with the physical package to prevent counterfeit substitution.

Diode Arrays Selection Notes

Select this component when designing circuits requiring high voltage isolation combined with significant current handling capabilities. The dual internal structure allows for flexible series configurations to manage elevated potential differences. Evaluate thermal management strategies to maintain junction temperatures within the specified operational limits during continuous conduction periods.

Diode Arrays Part Context

This device belongs to the SONIC-FRD product family from IXYS, specialized for fast recovery rectification. It utilizes advanced silicon planar technology to ensure stable performance under high stress conditions. The ISOPLUS i4-PAC-3 package provides robust mechanical stability and efficient heat dissipation pathways for industrial-grade deployments.

Diode Arrays Replacement Considerations

Public confirmed substitute part numbers are not available in the provided documentation. Verify compatibility with alternative high-voltage diode arrays based on matching voltage ratings, current capacities, and package dimensions before implementation.