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DMN2450UFD-7 is listed in the Single FETs, MOSFETs range at ChipApex. The manufacturer field lists Diodes Incorporated. Its product description is MOSFET N-CH 20V 900MA 3DFN. Review the specifications below when checking this part for your BOM.
The DMN2450UFD-7 is an N-channel enhancement mode MOSFET manufactured by Diodes Incorporated. It features a maximum drain-source voltage (BVDSS) of 20V and operates within a junction temperature range of -55°C to +150°C. The device utilizes an X1-DFN1212-3 package with a lead-free, RoHS-compliant construction. Key electrical parameters include a gate threshold voltage (VGS(TH)) ranging from 0.45V to 1.0V at ID=250μA. Static drain-source on-resistance (RDS(ON)) varies based on gate drive conditions: 0.6Ω max at VGS=4.5V/ID=200mA, 0.8Ω max at VGS=2.5V/ID=200mA, 1.0Ω max at VGS=1.8V/ID=100mA, and 1.6Ω max at VGS=1.5V/ID=50mA.
Verify the specific ordering suffix '-7' corresponds to the 3,000-unit tape and reel packaging configuration. Confirm that the component meets all applicable RoHS directives and halogen-free requirements as defined by the manufacturer's quality standards. Ensure the procurement channel is authorized to guarantee product authenticity and traceability.
Select this component when designing circuits requiring a compact footprint with an X1-DFN1212-3 package. Consider the low gate threshold voltage for compatibility with low-voltage control signals. Evaluate the thermal resistance characteristics against the expected power dissipation in the target application environment.
This part belongs to the DMN2450 series of N-channel enhancement mode MOSFETs produced by Diodes Incorporated. The series is engineered to minimize on-state resistance while maintaining superior switching performance. The DMN2450UFD variant specifically denotes the X1-DFN1212-3 surface-mount package configuration.
Consult official datasheets for alternative part numbers offering compatible pinouts and electrical ratings. Verify that any substitute component matches the required voltage, current, and thermal specifications before implementation.
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