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DMN26D0UFB4-7B is listed in the Single FETs, MOSFETs range at ChipApex. The manufacturer field lists Diodes Incorporated. Its product description is DIODE. Review the specifications below when checking this part for your BOM.
The DMN26D0UFB4-7B is an N-channel enhancement mode MOSFET from Diodes Incorporated, housed in an X2-DFN1006-3 surface-mount package. It features a drain-source voltage (VDSS) of 20V and a continuous drain current (ID) of 240mA at TA = +25°C with VGS = 4.5V. The device exhibits a maximum on-resistance (RDS(on)) of 3.0Ω at VGS = 4.5V and 6.0Ω at VGS = 1.8V. Gate-source voltage (VGSS) is rated at ±10V, with a gate threshold voltage (VGS(th)) ranging from 0.6V to 0.9V. Total power dissipation is 350mW at +25°C, and the operating temperature range spans -55°C to +150°C.
Verify the specific ordering suffix '-7B' corresponds to the 10,000-unit tape and reel packaging configuration as documented in the manufacturer's ordering information. Confirm that the component meets all applicable environmental compliance standards required for the intended deployment environment before finalizing procurement orders.
Select this component for applications requiring low on-state resistance within a compact footprint. Ensure the driving circuit can provide sufficient gate voltage to achieve the specified low RDS(on) values. Verify that the thermal management design accommodates the junction-to-ambient thermal resistance characteristics under expected load conditions.
This part belongs to the DMN series of N-channel enhancement mode MOSFETs manufactured by Diodes Incorporated. It utilizes silicon technology and is designed to minimize on-state resistance while maintaining superior switching performance. The device is qualified to JEDEC standards for high reliability.
For automotive applications requiring specific change control or AEC-Q qualification, consult the related automotive grade parts with the Q-suffix. Refer to the manufacturer's automotive product listing for verified alternatives meeting IATF 16949 manufacturing requirements.
The maximum package height is 0.4mm.
Yes, the device features an ESD protected gate.
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