DMN6013LFG-13

Overview

The DMN6013LFG-13 is a surface-mount N-channel enhancement mode MOSFET from Diodes Incorporated, housed in a PowerDI3333-8 package. It features a drain-source voltage (Vdss) of 60 V and a maximum continuous drain current (Id) of 10.3 A at Ta=+25°C, rising to 45 A at Tc=+25°C. The device exhibits a low on-state resistance (Rds(on)) of 13 mΩ max at Vgs=10V and 18 mΩ max at Vgs=4.5V. Total gate charge (Qg) is 55.4 nC max at Vgs=10V. Thermal characteristics include a power dissipation of 1 W at Ta=+25°C with a junction-to-ambient thermal resistance of 123 °C/W.

Feature Summary

• Designed to minimize on-state resistance while maintaining superior switching performance for high-efficiency power management.
• Small form factor thermally efficient package enables higher density end products.
• Occupies just 33% of board area compared to SO-8 packages, enabling smaller end product designs.

Applications

• Backlighting
• Power Management Functions
• DC-DC Converters

Procurement Notes

Verify the ordering suffix matches the required packaging quantity; DMN6013LFG-13 indicates a 3000-unit tape and reel, whereas -7 denotes 2000 units. Confirm RoHS compliance and lead-free status as specified by the manufacturer's green product definitions. Ensure the PowerDI3333-8 footprint aligns with the suggested pad layout provided in the datasheet to maintain thermal and electrical integrity during assembly.

Selection Notes

Select this component when a compact N-channel MOSFET with low Rds(on) is required for space-constrained designs. The 60V rating suits standard logic-level applications. Evaluate the thermal resistance values against the expected ambient temperature and duty cycle to ensure junction temperatures remain within the -55°C to +150°C operating range. Consider the gate charge specifications for driving requirements in switching applications.

Part Context

This part belongs to the DMN6013 series of 60V N-channel enhancement mode MOSFETs manufactured by Diodes Incorporated. It utilizes the PowerDI3333-8 case style, which is a molded plastic package with matte tin annealed terminals over a copper leadframe. The series is designed for high-density PCB layouts, offering significant board area reduction compared to traditional SO-8 packages while providing comparable or improved thermal performance.

Replacement Considerations

The DMN6013LFG-7 is a parameter-equivalent alternative available in a 2000-unit tape and reel packaging format. Verify that the specific packaging requirement of the target application dictates the choice between the -13 and -7 suffixes, as the electrical characteristics remain identical.

FAQ

What is the maximum continuous drain current at an ambient temperature of +70°C?

At an ambient temperature of +70°C, the maximum continuous drain current is 8.3 A.

Is this component qualified for automotive applications?

Yes, the DMN6013LFG series is qualified to AEC-Q101 standards for high reliability.