ChipApex | Global Electronic Components Supplier
SEARCH
Search Product
Search Post
— IC芯片 | 连接器 | 传感器 | 被动器件 —
Consult the customer manager about the wholesale price.
consultation hotline：86-132-6715-2157
email：[email protected]
Contact the product manager for consultation. One-stop consultation is available.
Do you want a lower wholesale price? Please send us your inquiry and we will reply immediately.
Product Detailed Parameters
- Description：MOSFET N-CH 600V 80MA SOT23-3
- Series：-
- Mfr：Diodes Incorporated
- Package：Tape & Reel (TR)
- FET Type：-
- Technology：-
- Drain to Source Voltage (Vdss)：-
- Current - Continuous Drain (Id) @ 25°C：-
- Drive Voltage (Max Rds On, Min Rds On)：-
- Rds On (Max) @ Id, Vgs：-
- Vgs(th) (Max) @ Id：-
- Gate Charge (Qg) (Max) @ Vgs：-
- Vgs (Max)：-
- Input Capacitance (Ciss) (Max) @ Vds：-
- FET Feature：-
- Power Dissipation (Max)：-
- Operating Temperature：-
- Grade：-
- Qualification：-
- Mounting Type：-
- Supplier Device Package：-
- Package / Case：-
Download product information
Overview
The DMN60H80DHFF-7 is a single N-channel enhancement mode MOSFET manufactured by Diodes Incorporated. It features a breakdown voltage range of 41V to 60V and utilizes the PowerDI 5060 package for surface mount applications. The device is designed for high-efficiency switching in power management circuits, offering low on-resistance characteristics suitable for DC-DC converters and load switch implementations.
Feature Summary
- Single N-channel enhancement mode configuration
- Surface mount PowerDI 5060 package design
- Optimized for low on-resistance performance
Applications
- DC-DC converter output stages
- Load switch implementations
- Power management integrated circuits
Procurement Notes
Verify the specific datasheet revision and electrical parameter limits directly from the manufacturer's official documentation before integration. Confirm that the PowerDI 5060 footprint matches the target PCB layout requirements. Ensure thermal management strategies align with the component's power dissipation specifications under expected operating conditions.
Selection Notes
Select this component when a compact surface-mount solution is required for low-voltage switching applications. The PowerDI 5060 package offers a balance between current handling capability and board space efficiency. Consider the specific Rds(on) and thermal resistance values relative to the system's heat dissipation capabilities during the design phase.
Part Context
This part belongs to Diodes Incorporated's discrete semiconductor lineup, specifically within the MOSFET category. It is engineered for general-purpose switching tasks in consumer electronics and industrial equipment where space constraints and switching efficiency are critical design factors.
Replacement Considerations
Consult official substitution guides for compatible alternatives. Verify pinout compatibility and electrical parameter equivalence before replacing the component in existing designs.
