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The DMN62D1LFB-7B is an N-channel enhancement mode MOSFET manufactured by Diodes Incorporated. It features a maximum drain-source voltage (V_DSS) of 60 V and a gate-source voltage (V_GSS) rating of ±20 V. The device provides a continuous drain current (I_D) of 407 mA at +25°C, with a static drain-source on-resistance (R_DS(ON)) of 2 Ω at V_GS = 4 V and 2.5 Ω at V_GS = 2.5 V. It operates within a junction temperature range of -55°C to +150°C and dissipates up to 0.5 W. The component is housed in an X1-DFN1006-3 surface-mount package.
Verify the specific ordering suffix '-7B' against official Diodes Incorporated documentation to confirm the reel size and tape width specifications. Ensure the procurement channel is authorized to maintain product integrity and access valid datasheets. Confirm compliance requirements such as RoHS 3 and REACH status directly from the manufacturer's quality statements before finalizing orders.
Select this component when a compact N-channel MOSFET with a 60 V breakdown voltage is required for low-current switching tasks. The X1-DFN1006-3 package offers a small footprint suitable for space-constrained designs. Evaluate the R_DS(ON) values at your specific gate drive voltages to ensure adequate conduction efficiency for your load requirements.
This part belongs to the DMN62 series of N-channel enhancement mode MOSFETs produced by Diodes Incorporated. The series focuses on providing low on-resistance and fast switching capabilities in miniature packages. The DMN62D1LFB variant specifically utilizes the X1-DFN1006-3 case style, distinguishing it from other members of the family that may use different physical footprints or pin configurations.
Consult the official Diodes Incorporated datasheet for verified substitute part numbers. Do not assume cross-compatibility with other manufacturers without verifying electrical parameters and pinout definitions.
The maximum continuous drain current is 407 mA at an ambient temperature of +25°C.
Yes, the device includes ESD protection and a gate protection diode.
The thermal resistance (RθJA) is 251 °C/W when mounted on an FR-4 PCB with minimum recommended pad layout.