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The DMP2004TK is a P-channel enhancement mode MOSFET manufactured by Diodes Incorporated. It features a drain-source voltage (VDSS) of -20V and a gate-source voltage (VGSS) rating of ±8V. The device operates within a junction temperature range of -55°C to +150°C. Key electrical characteristics include a maximum static drain-source on-resistance (RDS(ON)) of 1.3Ω at VGS = -4.5V and ID = -430mA, and a gate threshold voltage (VGS(TH)) ranging from -0.5V to -1.0V. The component utilizes an SOT523 surface-mount package.
Verify that the specific ordering suffix matches the required packaging configuration, as standard tape and reel quantities are specified in the manufacturer documentation. Confirm compliance with current environmental directives such as RoHS 3 and REACH status before finalizing procurement specifications. Ensure the source channel is authorized to prevent counterfeit components.
Select this component when a compact SOT523 footprint is required for P-channel switching applications. Evaluate the thermal resistance parameters against the expected duty cycle and ambient temperature conditions. Consider the low gate threshold voltage suitability for logic-level control interfaces and the AEC-Q101 qualification if automotive grade reliability is mandated.
This part belongs to the DMP2004 series of P-channel MOSFETs designed for general-purpose switching. The 'TK' designation indicates the specific SOT523 case style and associated packaging format. It serves as a compact alternative to larger packages while maintaining comparable electrical performance metrics for low-voltage power management tasks.
Consult official substitution lists or cross-reference databases for verified equivalents. Verify pinout compatibility and ensure replacement parts meet identical voltage, current, and thermal ratings.
The maximum steady-state drain current is -430 mA at an ambient temperature of +25°C and -310 mA at +85°C.
Yes, the device is qualified to AEC-Q101 standards for high reliability, making it suitable for automotive environments.