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The DMPH6051SFVW-7 is a P-channel enhancement mode MOSFET manufactured by Diodes Incorporated, housed in a PowerDI3333-8 package. It features a drain-source voltage (BVDSS) of -60V and a maximum continuous drain current (ID) of -20.6A at +25°C. The device offers a low on-state resistance (RDS(ON)) of 60mΩ at VGS = -10V and 80mΩ at VGS = -4.5V. It supports an operating temperature range from -55°C to +175°C and includes wettable flank terminals for enhanced optical inspection.
Verify the specific ordering suffix (-7 or -13) against the required tape and reel quantity before procurement. Confirm that the standard industrial grade part meets application requirements; automotive-grade variants with Q-suffixes are available separately for AEC-Q100/101 qualified designs. Ensure compatibility with the PowerDI3333-8/SWP footprint.
Select this component for applications requiring high-efficiency power management with superior switching performance. The low RDS(ON) minimizes conduction losses, while the robust thermal rating supports high ambient temperatures. Verify gate drive voltages align with the specified thresholds for optimal on-resistance performance.
This part belongs to Diodes Incorporated's PowerDI series, designed to minimize on-state resistance while maintaining switching speed. It utilizes a molded plastic case with a copper leadframe and matte tin finish. The device is fully RoHS compliant and halogen-free, adhering to JEDEC standards for high reliability.
For automotive applications requiring specific change control and AEC-Q qualification, refer to the related automotive grade parts with the Q-suffix. Standard industrial replacements must match the -60V rating, P-channel configuration, and PowerDI3333-8 package dimensions.
No, this specific part number is qualified to JEDEC standards for high reliability. Automotive applications requiring AEC-Q100/101 qualification and PPAP capability should use the related automotive grade parts with the Q-suffix.
The wettable flank design allows solder to extend along the side of the leads, enabling improved optical inspection of solder joints to ensure proper connection quality.