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EPC1441TC32N is listed in the Configuration PROMs For FPGAs range at ChipApex. The manufacturer field lists Altera. Its product description is IC CONFIG DEVICE 440KBIT 32TQFP. Review the specifications below when checking this part for your BOM.
The Altera EPC1441TC32N is a one-time programmable (OTP) configuration PROM designed for FLEX FPGA devices. It provides 440 kbit of storage capacity and operates within a voltage range of 3V to 3.6V or 4.75V to 5.25V. The component supports a maximum operating frequency of 8 MHz and functions across an industrial temperature range of 0°C to 70°C. It is housed in a 32-TQFP package with dimensions of 7x7 mm, featuring surface-mount installation.
Verify the specific suffix 'TC32N' against official Intel/Altera documentation to confirm the commercial temperature grade and RoHS compliance status. Cross-reference the manufacturer part number with current product change notifications to ensure availability and lifecycle status, as this device may be discontinued. Confirm pinout compatibility with existing PCB layouts before procurement.
Select this component when configuring FLEX family FPGAs that require 440 kbit of non-volatile storage. Ensure the design environment supports the specified 3V or 5V supply rails. Verify that the application temperature constraints align with the 0°C to 70°C commercial rating rather than the extended -40°C to 85°C range offered by other variants.
This device belongs to the Enhanced Configuration (EPC) series from Altera, specifically tailored for FLEX architecture FPGAs. It serves as a dedicated configuration memory solution, replacing earlier EPROM-based methods. The part is distinct from the EPC1441TI32N variant, which offers an extended industrial temperature range instead of the commercial range provided here.
The EPC1441TI32N is a direct functional substitute offering the same electrical specifications but with an extended industrial temperature range (-40°C to 85°C). Verify that the higher temperature rating does not introduce compatibility issues with the target system's thermal management requirements.
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