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The EPC2032 is an enhancement-mode GaN FET die with a 100V drain-source voltage rating. It features a maximum on-resistance of 4mΩ at 5V gate drive and supports a continuous drain current of 48A (Ta). The device exhibits low gate charge of 15nC and input capacitance of 1530pF. Operating junction temperature ranges from -40°C to 150°C, with gate voltage limits of +6V and -4V.
Verify the specific ordering suffix to confirm packaging format, such as tape-and-reel or cut-tape options. Ensure compatibility with surface-mount assembly processes suitable for bare die components. Confirm RoHS compliance status if required by end-product regulations. Check for any recent production change notices affecting material composition or assembly guidelines.
Select this component when designing circuits requiring 100V blocking capability with minimal conduction loss. The 48A continuous current rating suits moderate power applications. Consider thermal management strategies appropriate for bare die mounting. Evaluate gate drive requirements against the specified +/- 6V limits to ensure reliable switching performance.
Part of the eGaN FET family, the EPC2032 shares characteristics with related models like EPC2030 and EPC2031. These devices utilize similar enhancement-mode GaN technology optimized for power density. The EPC20xx series provides standardized electrical parameters for designers integrating wide-bandgap semiconductors into modern power electronics architectures.
No public confirmed substitute part numbers are available in the provided documentation.