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The EPC2057 is an enhancement mode eGaN FET power transistor with a 50 V drain-to-source voltage rating and a maximum on-resistance of 8.5 mΩ at 6 A. It features a continuous drain current of 9.6 A and operates within a junction temperature range of -40°C to 150°C. The device utilizes a lateral structure for zero reverse recovery charge and low gate charge, supplied as a passivated die with solder bars in a 1.5 x 1.2 mm footprint.
Verify the specific package configuration upon ordering, as the EPC2057 is supplied exclusively in passivated die form equipped with solder bars. Confirm that procurement channels provide the correct tape and reel specifications, which utilize a 4 mm pitch and 8 mm width on a 7-inch reel. Ensure handling procedures account for the bare die nature of the component during assembly.
Select this component for designs requiring high efficiency and minimal switching losses in the 50 V range. The device is suitable for applications where small footprint and high power density are critical. Consider the thermal resistance characteristics when designing heat dissipation solutions, particularly if utilizing dual-sided cooling methods for optimal performance.
This part belongs to the eGaN FET family from Efficient Power Conversion Corporation. These transistors leverage Gallium Nitride technology to achieve superior electron mobility and low temperature coefficients compared to traditional silicon MOSFETs. The EPC2057 specifically targets high-frequency power conversion tasks where low on-state losses and fast switching transitions are required.
No public confirmed substitute part numbers are documented in the provided datasheet.
No, the device does not require a negative voltage for the OFF state; a typical gate drive ON level is 5 V and OFF is 0 V.
The EPC2057 is supplied only in passivated die form with solder bars, featuring a die size of 1.5 x 1.2 mm.