F3L11MR12W2M1HB19BPSA1

$119.30

Description：LOW POWER EASY
Series：-

SKU:2baab215c240 Category: IGBT Modules Brand: Infineon Technologies

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Product introduction

Product Detailed Parameters

Description：LOW POWER EASY
Series：-
Mfr：Infineon Technologies
Package：Tray
IGBT Type：-
Configuration：-
Vce(on) (Max) @ Vge, Ic：-
Input：-
NTC Thermistor：-
Operating Temperature：-
Mounting Type：-
Package / Case：-
Supplier Device Package：-
Voltage - Collector Emitter Breakdown (Max)：-
Current - Collector (Ic) (Max)：-
Power - Max：-
Current - Collector Cutoff (Max)：-
Input Capacitance (Cies) @ Vce：-

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F3L11MR12W2M1HB19BPSA1

Overview

The F3L11MR12W2M1HB19BPSA1 is a three-level CoolSiC Trench MOSFET module manufactured by Infineon Technologies. It utilizes silicon carbide (SiC) technology and is housed in an EasyPACK package. The device features a drain-source breakdown voltage of 1200 V. It is designed for high-frequency power conversion applications requiring low switching losses and high thermal efficiency.

Feature Summary

Integrates CoolSiC Trench MOSFET technology for enhanced switching performance
Configured as a three-level module within the EasyPACK form factor
Supports operation at elevated temperatures up to +175°C junction temperature

Applications

Three-level neutral-point-clamped (NPC) inverters
High-efficiency motor drives
Industrial power supplies

Procurement Notes

Verify the specific suffix BPSA1 against the manufacturer's current ordering guide to ensure correct tape-and-reel or tray packaging configuration. Confirm that the requested quantity matches the factory pack size specified in the latest datasheet revision. Cross-reference the component marking with the official Infineon identification codes to prevent counterfeit substitution during assembly.

Selection Notes

Select this component when designing systems requiring three-level topology with SiC devices. Ensure the gate driver supports the required voltage levels for trench MOSFETs. Verify thermal management solutions can handle the power dissipation characteristics defined in the datasheet. Check compatibility with the EasyPACK mounting requirements for mechanical stability.

Part Context

This part belongs to Infineon's CoolSiC family, specifically utilizing Trench technology for lower on-resistance compared to planar variants. It is part of the M1 series modules, which are optimized for high-power density applications. The EasyPACK format allows for standardized mounting in various industrial inverter designs.

Replacement Considerations

Direct replacements must match the 1200V rating, three-level configuration, and EasyPACK footprint. Consider the F3L8MR12W2M1HPB11BPSA1 if a different current rating or specific sub-series variation is acceptable, provided the pinout and thermal interface remain compatible.

How to buy

Online and offline orders are supported. If the item is available for online purchase, you can place it in the cart; for wholesale pricing, please contact our product manager for a quote.

Payment Method

Payment methods: T/T, WeChat Pay, credit cards, Google Pay, Apple Pay . Buyer covers shipping, fees, duties, and taxes; contact our product manager if you need a contract/procurement process.

Delivery time

In-stock items usually ship within 24 hours. Otherwise, shipment is arranged 1 to 2 days after the items arrive at our warehouse. Timing depends on destination and shipping method.

Freight calculation

Freight cost depends on destination, package size, and weight . We offer shipping options via DHL, FedEx, UPS, and TNT , and can ship using your freight account upon request.

Mode of Transportation

We ship via DHL, FedEx, UPS, and TNT. If you prefer a specific logistics provider, we can ship using your designated carrier.

Return and Refund

Returns are accepted within 60 days of invoice with RMA approval. Items must be resalable; original invoice and test report are required. No returns for customer errors.