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Product Detailed Parameters
- Description：LOW POWER EASY
- Series：-
- Mfr：Infineon Technologies
- Package：Tray
- IGBT Type：-
- Configuration：-
- Vce(on) (Max) @ Vge, Ic：-
- Input：-
- NTC Thermistor：-
- Operating Temperature：-
- Mounting Type：-
- Package / Case：-
- Supplier Device Package：-
- Voltage - Collector Emitter Breakdown (Max)：-
- Current - Collector (Ic) (Max)：-
- Power - Max：-
- Current - Collector Cutoff (Max)：-
- Input Capacitance (Cies) @ Vce：-
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Overview
The F3L11MR12W2M1HPB19BPSA1 is a CoolSiC Trench MOSFET half-bridge module in the EasyPACK package. It features a 1200 V drain-source voltage and an implemented current of 75 A, with a repetitive peak current of 150 A. The on-resistance is typically 16 mΩ at 25°C. Operating junction temperatures range from -40°C to 175°C. The module integrates PressFIT contacts, mounting clamps, pre-applied thermal interface material, and an NTC thermistor.
Feature Summary
- Integrated NTC temperature sensor for thermal monitoring
- PressFIT contact technology for robust electrical connection
- Pre-applied thermal interface material for simplified assembly
- Rugged mechanical design with integrated mounting clamps
Applications
- Solar applications
- Three-level applications
- DC charger for EV
Procurement Notes
Verify the specific ordering suffix B19 against official Infineon documentation to confirm exact manufacturing lot specifications. Ensure compatibility with required gate drive voltages and thermal management systems before procurement. Confirm industrial qualification standards are met for the target deployment environment.
Selection Notes
Select this component for high-frequency switching applications requiring low conduction losses. Evaluate the thermal resistance values relative to the heatsink design. Consider the stray inductance characteristics when designing the power loop layout to minimize voltage overshoot during switching transitions.
Part Context
This part belongs to the Infineon CoolSiC generation 2 industrial series. It utilizes silicon carbide trench technology to achieve superior performance compared to traditional silicon devices. The EasyPACK form factor allows for standardized mounting solutions within various power electronic converter architectures.
Replacement Considerations
Consult official replacement guides for cross-referencing. Verify pinout compatibility and thermal interface requirements when substituting similar modules. Ensure that any alternative device meets or exceeds the original voltage and current ratings.
FAQ
What is the maximum operating junction temperature?
The maximum operating junction temperature is 175°C.
Does the module include an integrated temperature sensor?
Yes, the module includes an integrated NTC thermistor for temperature monitoring.
What type of terminal connection does this module use?
The module uses PressFIT contact technology for its terminals.
