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Product Detailed Parameters
- Description：IGBT MOD 650V 150A 335W
- Series：EasyPACK™
- Mfr：Infineon Technologies
- Package：Tray
- IGBT Type：Trench Field Stop
- Configuration：Single
- Vce(on) (Max) @ Vge, Ic：1.9V @ 15V, 150A
- Input：Standard
- NTC Thermistor：Yes
- Operating Temperature：-40°C ~ 150°C
- Mounting Type：Chassis Mount
- Package / Case：Module
- Supplier Device Package：Module
- Voltage - Collector Emitter Breakdown (Max)：650 V
- Current - Collector (Ic) (Max)：150 A
- Power - Max：335 W
- Current - Collector Cutoff (Max)：1 mA
- Input Capacitance (Cies) @ Vce：9.3 nF @ 25 V
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Overview
The F3L150R07W2E3B11BOMA1 is a three-phase inverter IGBT module from Infineon's Trenchstop IGBT3 series, housed in an EasyPACK package. It features a collector-emitter voltage (VCES) of 650 V and a nominal continuous DC collector current (IC nom) of 150 A at 25°C case temperature. The typical collector-emitter saturation voltage (VCEsat) is 1.45 V at 25°C. Total power dissipation is rated at 335 W. The module integrates emitter-controlled diodes and includes a built-in NTC thermistor with a nominal resistance of 5 kΩ at 25°C.
Feature Summary
- Low-inductive design for reduced switching losses
- PressFIT contact technology for robust mounting
- Integrated NTC thermistor for thermal monitoring
Applications
- Three-level applications
- Solar applications
- UPS systems
Procurement Notes
Verify the specific ordering suffix BOMA1 against official documentation to confirm exact configuration details. Ensure compatibility with PressFIT assembly processes and verify that the 650V rating aligns with system requirements. Confirm RoHS compliance status through the manufacturer's latest product data sheet before finalizing procurement.
Selection Notes
Select this component for designs requiring a 650V rating with 150A continuous current capability. Consider the low thermal resistance of the Al2O3 substrate for efficient heat dissipation. Evaluate the gate threshold voltage and internal gate resistor values to ensure proper driver interface matching and optimal switching performance within the specified operating temperature range.
Part Context
This part belongs to the Infineon EasyPACK family utilizing Trenchstop IGBT3 technology. It is designed as a compact solution for medium-power industrial and renewable energy applications. The module integrates six switches (three IGBTs and three diodes) into a single unit, simplifying circuit board layout and reducing parasitic inductance compared to discrete solutions.
Replacement Considerations
Publicly confirmed substitute part numbers are not available in the provided source material. Verify mechanical footprint and electrical parameters against alternative models if sourcing changes occur.
