F3L200R07W2S5PB95BPSA1

F3L200R07W2S5PB95BPSA1

$68.02
  • Description:F3L200R07W2S5PB95BPSA1
  • Series:EasyPACK™

SKU:b08c1a3f0bcf Category: Brand:

  
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Product Detailed Parameters

  • Description:F3L200R07W2S5PB95BPSA1
  • Series:EasyPACK™
  • Mfr:Infineon Technologies
  • Package:Box
  • IGBT Type:Trench Field Stop
  • Configuration:Three Level Inverter
  • Vce(on) (Max) @ Vge, Ic:1.67V @ 15V, 150A
  • Input:Standard
  • NTC Thermistor:Yes
  • Operating Temperature:-40°C ~ 150°C (TJ)
  • Mounting Type:Chassis Mount
  • Package / Case:Module
  • Supplier Device Package:-
  • Voltage - Collector Emitter Breakdown (Max):650 V
  • Current - Collector (Ic) (Max):200 A
  • Power - Max:-
  • Current - Collector Cutoff (Max):45 µA
  • Input Capacitance (Cies) @ Vce:14300 pF @ 25 V

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F3L200R07W2S5PB95BPSA1

Overview

The Infineon F3L200R07W2S5PB95BPSA1 is a three-phase inverter IGBT module utilizing TRENCHSTOP™ 5 technology and CoolSiC™ Schottky diodes. It features PressFIT contact technology and an integrated NTC thermistor. The collector-emitter voltage (VCES) is rated at 650 V, with an implemented collector current (ICN) of 200 A and a continuous DC collector current (ICDC) of 95 A at TH = 65°C. The repetitive peak collector current (ICRM) reaches 400 A. The CoolSiC™ diodes offer increased blocking voltage capability up to 650 V. The module operates within a junction temperature range of -40°C to 150°C.

Feature Summary

  • Integrates TRENCHSTOP™ 5 IGBTs with CoolSiC™ Gen 5 Schottky diodes for low switching losses.
  • Utilizes PressFIT connection technology for robust mounting without soldering.
  • Features an Al2O3 substrate providing low thermal resistance.
  • Includes an integrated NTC thermistor for precise temperature monitoring.

Applications

  • 3-level applications
  • Motor drives
  • Solar applications
  • UPS systems

Procurement Notes

Verify the specific ordering suffix against official documentation to confirm mechanical or electrical variations. Confirm compatibility with PressFIT assembly tools and required mounting forces. Ensure the selected variant matches the intended application requirements regarding voltage ratings and thermal management specifications before procurement.

Selection Notes

Select this module for high-efficiency power conversion requiring low switching losses. Consider the 650 V rating and 200 A implemented current for appropriate load matching. Evaluate the thermal resistance characteristics and the necessity of the integrated NTC sensor for system design. Verify that the operating environment supports the specified junction temperature limits.

Part Context

This component belongs to the EasyPACK™ module series from Infineon Technologies. It combines silicon IGBT technology with silicon carbide diodes to enhance performance in power electronics. The module is designed for compact designs with rugged mounting capabilities, suitable for demanding industrial and automotive environments.

Replacement Considerations

Public confirmed substitute part numbers are not available in the provided source material. Consult official Infineon resources for cross-referencing compatible modules based on specific electrical and mechanical requirements.

FAQ

What type of contact technology does the module use?

The module utilizes PressFIT contact technology for connection.

What is the maximum collector-emitter voltage rating?

The collector-emitter voltage (VCES) is rated at 650 V.

Does the module include temperature sensing?

Yes, the module includes an integrated NTC thermistor.

F3L200R07W2S5PB95BPSA1F3L200R07W2S5PB95BPSA1
$68.02
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