F3L400R07W3S5B59BPSA1

Overview

The F3L400R07W3S5_B59 is a three-level EasyPACK™ IGBT module featuring TRENCHSTOP™ 5 technology and emitter-controlled diodes. It provides a collector-emitter voltage (VCES) of 650 V with implemented currents of 200 A for the primary legs and 300 A for the secondary legs, supporting repetitive peak currents up to 600 A. The module utilizes PressFIT contact technology and includes an integrated NTC temperature sensor. Designed for high power density, it incorporates an Al2O3 substrate with low thermal resistance and is qualified for industrial applications.

Feature Summary

• TRENCHSTOP™ 5 technology combined with emitter-controlled diodes for optimized switching performance
• PressFIT contact technology enabling secure mechanical connection without soldering
• Integrated NTC thermistor for precise internal temperature monitoring
• Al2O3 substrate design providing low thermal resistance and high power density

Applications

• Solar inverter systems
• Three-level active neutral point clamped (ANPC) topologies
• Industrial motor drives

Procurement Notes

Verify the specific B59 suffix against official Infineon documentation to confirm exact manufacturing lot details and revision status. Ensure that the ordering information matches the required datasheet version. Confirm compliance with relevant industrial qualification standards such as IEC 60747 prior to final procurement decisions.

Selection Notes

Select this component for designs requiring high current handling within a compact form factor. The dual-current configuration supports asymmetric leg requirements common in three-level inverters. Verify that the system's thermal management aligns with the specified junction-to-heatsink thermal resistance values under expected operating conditions.

Part Context

This module belongs to Infineon's EasyPACK™ family, designed for flexible integration into modern power electronics. It represents a generation utilizing TRENCHSTOP™ 5 technology, offering improved efficiency compared to previous iterations. The product targets high-power renewable energy and industrial conversion applications where reliability and space constraints are critical.

Replacement Considerations

Direct replacements must match the 650 V rating, EasyPACK™ 3B footprint, and PressFIT interface. Evaluate alternative models based on comparable saturation voltages and thermal resistance characteristics to ensure equivalent circuit performance.