F3L500R12W3H7H11BPSA1

Overview

The F3L500R12W3H7H11BPSA1 is an Infineon Technologies IGBT module utilizing the EasyPACK 3B package. It integrates TRENCHSTOP™ IGBT7 H7 technology with emitter-controlled diodes, designed for high switching frequency applications in 1000 VDC systems. The module features a quad configuration and supports PressFIT mounting with integrated NTC thermal sensing. Key electrical parameters include a collector-emitter saturation voltage of 2 V, a gate-emitter leakage current of 100 nA, and a power dissipation rating of 20 mW. It operates within a temperature range of -40°C to +175°C and has a maximum gate-emitter voltage of 20 V.

Feature Summary

• Integrates TRENCHSTOP™ IGBT7 H7 technology for superior controllability and reduced losses in industrial drives.
• Features emitter-controlled diodes to enhance performance and simplify application design.
• Supports PressFIT mounting for robust mechanical connection and efficient thermal management.
• Includes integrated NTC thermistor for precise junction temperature monitoring.

Applications

• High-frequency solar string inverters
• Energy storage systems (ESS)
• Industrial motor drives

Procurement Notes

Verify component authenticity through authorized distributors or direct manufacturer channels. Confirm that the ordering suffix matches the specific technical variant required for your design. Check for RoHS compliance status and ensure the package type aligns with your PCB layout constraints. Validate the presence of the NTC sensor if thermal monitoring is critical to your system architecture.

Selection Notes

Select this module for applications requiring high switching frequencies and low conduction losses in 1000 VDC systems. Ensure the thermal management solution can handle the specified power dissipation and operating temperature range. Verify that the PressFIT mounting method is compatible with the target assembly process. Consider the quad configuration when designing the three-phase inverter topology.

Part Context

This part belongs to the EasyPACK 3B series, which expands Infineon's portfolio for 1000 VDC systems. It complements other modules like the FS3L40R12W2H7P_B11 by offering a specific configuration for single-phase NPC2 topologies. The series is designed to provide cost-effective solutions for high-power applications such as solar inverters and energy storage.

Replacement Considerations

Direct substitutes are not explicitly listed in public documentation. Evaluate alternative EasyPACK 3B variants with similar voltage ratings and current capabilities. Ensure any replacement maintains compatibility with the PressFIT mounting style and includes necessary thermal sensing features.