F3L75R12W1H3PB11BPSA1

$47.94

Description：LOW POWER EASY AG-EASY1B-311
Series：-

SKU:52c0836e4c89 Category: IGBT Modules Brand: Infineon Technologies

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Product introduction

Product Detailed Parameters

Description：LOW POWER EASY AG-EASY1B-311
Series：-
Mfr：Infineon Technologies
Package：Tray
IGBT Type：-
Configuration：-
Vce(on) (Max) @ Vge, Ic：-
Input：-
NTC Thermistor：-
Operating Temperature：-
Mounting Type：-
Package / Case：-
Supplier Device Package：-
Voltage - Collector Emitter Breakdown (Max)：-
Current - Collector (Ic) (Max)：-
Power - Max：-
Current - Collector Cutoff (Max)：-
Input Capacitance (Cies) @ Vce：-

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F3L75R12W1H3PB11BPSA1

Overview

The F3L75R12W1H3PB11BPSA1 is a silicon-based IGBT module from Infineon Technologies, belonging to the F3LXR12W1J series. It features a 1200 V collector-emitter voltage rating and a continuous collector current of 75 A at 25°C. The component utilizes Trenchstop technology for improved switching performance. Packaged in a tray format with a factory pack quantity of 30 units, this module is designed for industrial applications requiring reliable power conversion.

Feature Summary

Integrates Trenchstop IGBT technology for enhanced efficiency and switching characteristics.
Features a robust 1200 V voltage rating suitable for medium-voltage power electronics.
Provides a high continuous current capacity of 75 A for demanding industrial loads.

Applications

Industrial motor drives
Uninterruptible power supplies (UPS)
Induction heating systems

Procurement Notes

Verify the specific ordering suffix BPSA1 against official Infineon documentation to confirm exact pinout and thermal interface specifications. Ensure compatibility with existing PCB layouts and cooling solutions before procurement. Cross-reference the manufacturer part number with authorized distributor lists to validate authenticity and traceability.

Selection Notes

Select this module for applications requiring a balance of high current density and medium voltage blocking capability. Consider the thermal resistance characteristics inherent to the EasyPACK package when designing heat sinks. Evaluate gate drive requirements compatible with Trenchstop technology to optimize switching losses and ensure safe operating area compliance.

Part Context

This component is part of Infineon's broader portfolio of IGBT modules, specifically leveraging Trenchstop technology to reduce switching losses. It serves as a key building block in power conversion systems where reliability and compact design are critical. The module represents an evolution in silicon-based power semiconductor solutions for industrial markets.

Replacement Considerations

Consult official Infineon substitution guides for direct replacements. Verify electrical parameters such as Vceo, Ic, and package dimensions match exactly. Ensure any substitute maintains compatibility with existing gate drive circuits and thermal management infrastructure.

How to buy

Online and offline orders are supported. If the item is available for online purchase, you can place it in the cart; for wholesale pricing, please contact our product manager for a quote.

Payment Method

Payment methods: T/T, WeChat Pay, credit cards, Google Pay, Apple Pay . Buyer covers shipping, fees, duties, and taxes; contact our product manager if you need a contract/procurement process.

Delivery time

In-stock items usually ship within 24 hours. Otherwise, shipment is arranged 1 to 2 days after the items arrive at our warehouse. Timing depends on destination and shipping method.

Freight calculation

Freight cost depends on destination, package size, and weight . We offer shipping options via DHL, FedEx, UPS, and TNT , and can ship using your freight account upon request.

Mode of Transportation

We ship via DHL, FedEx, UPS, and TNT. If you prefer a specific logistics provider, we can ship using your designated carrier.

Return and Refund

Returns are accepted within 60 days of invoice with RMA approval. Items must be resalable; original invoice and test report are required. No returns for customer errors.