FAB1200UCX

Overview

The FAB1200UCX is a Class G audio amplifier integrated circuit designed for headphone and stereo output applications. It operates within a supply voltage range of 2.5V to 5.5V, delivering an output power of 51mW per channel into a 16-ohm load. The device features a compact 16-WLCSP package with dimensions of 1.71x1.71mm. It supports an operating temperature range from -40°C to +85°C.

Feature Summary

• Class G architecture for efficient audio amplification
• Stereo output configuration for dual-channel audio
• Ultra-small footprint suitable for portable devices

Applications

• Headphone amplification
• Stereo audio output stages
• Portable electronic devices requiring low-power audio solutions

Procurement Notes

Verify the manufacturer part number against official Fairchild Semiconductor documentation to ensure authenticity. Confirm that the specific suffix matches the required package type and temperature rating. Cross-reference ordering information with authorized distributors to avoid counterfeit components. Ensure compliance with relevant export control classifications such as EAR99 if applicable.

Selection Notes

Select this component when a compact, low-power stereo amplifier is required for battery-operated devices. The Class G topology offers efficiency benefits over linear amplifiers. Ensure the system supply voltage remains within the 2.5V to 5.5V range. Verify that the 16-WLCSP package fits the available PCB space constraints.

Part Context

This component belongs to the Fairchild Semiconductor linear audio amplifier family. It is specifically engineered for high-fidelity audio reproduction in small form factors. The device integrates necessary protection features typical of modern audio ICs. It serves as a direct solution for replacing older discrete audio amplifier designs in consumer electronics.

Replacement Considerations

Check for pin-compatible alternatives within the same Fairchild or ON Semiconductor portfolio. Verify that substitute parts maintain the same Class G operation and WLCSP package dimensions. Ensure thermal performance and output power specifications meet or exceed the original requirements.