FET, MOSFET Arrays FAM65CR51ADZ1 product image

FAM65CR51ADZ1

$27.13
  • Description:MOSFET 2N-CH 650V 41A APMCD-B16
  • Series:-

SKU:8b7d10663cff Category: Brand:

  
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FAM65CR51ADZ1 is listed in the FET, MOSFET Arrays range at ChipApex. The manufacturer field lists onsemi. Its product description is MOSFET 2N-CH 650V 41A APMCD-B16. Review the specifications below when checking this part for your BOM.

FET, MOSFET Arrays specifications for FAM65CR51ADZ1

  • Description:MOSFET 2N-CH 650V 41A APMCD-B16
  • Series:-
  • Mfr:onsemi
  • Package:Tube
  • Technology:Silicon Carbide (SiC)
  • Configuration:2 N-Channel
  • FET Feature:-
  • Drain to Source Voltage (Vdss):650V
  • Current - Continuous Drain (Id) @ 25°C:41A (Tc)
  • Rds On (Max) @ Id, Vgs:51mOhm @ 20A, 10V
  • Vgs(th) (Max) @ Id:5V @ 3.3mA
  • Gate Charge (Qg) (Max) @ Vgs:123nC @ 10V
  • Input Capacitance (Ciss) (Max) @ Vds:4864pF @ 400V
  • Power - Max:189W (Tc)
  • Operating Temperature:-55°C ~ 150°C (TJ)
  • Mounting Type:Through Hole
  • Package / Case:12-SSIP Exposed Pad, Formed Leads
  • Supplier Device Package:APMCD-B16
  • Grade:Automotive
  • Qualification:AEC-Q101

FET, MOSFET Arrays datasheet and documents for FAM65CR51ADZ1

FAM65CR51ADZ1

FET, MOSFET Arrays Overview

The FAM65CR51ADZ1 is a Boost Converter Stage in the APM16 Series designed for multiphase and semi-bridgeless Power Factor Correction (PFC) with Silicon Carbide (SiC) diodes. It features two N-channel MOSFETs and SiC boost diodes integrated into an APM16-CDA package with Y-shape lead forming on an Al2O3 Direct Bond Copper substrate. Key electrical specifications include a 650 V Drain-to-Source Breakdown Voltage, a typical RDS(ON) of 44 mΩ at 25°C, and a continuous drain current of 41 A at TC = 25°C. The module provides 5 kV isolation and operates within a junction temperature range of -55°C to +150°C.

FET, MOSFET Arrays Feature Summary

  • Integrated SIP or DIP Boost Converter Stage Power Module for On-board Charger (OBC) in EV or PHEV
  • 5 kV/1 sec Electrically Isolated Substrate for Easy Assembly
  • Creepage and Clearance per IEC60664−1, IEC 60950−1
  • Compact Design for Low Total Module Resistance
  • Module Serialization for Full Traceability
  • Lead Free, RoHS and UL94V−0 Compliant
  • Automotive Qualified per AEC Q101 and AQG324 Guidelines
  • Improved Performance with SiC Diodes

FET, MOSFET Arrays Applications

  • PFC Stage of an On-board Charger in PHEV or EV

FET, MOSFET Arrays Procurement Notes

Verify the specific ordering suffix 'D' corresponds to the APM16-CDA package with Y-shape lead forming and Al2O3 substrate as documented in the datasheet. Confirm that the component meets automotive qualification standards including AEC Q101 and AQG324 guidelines required for your application. Ensure proper handling procedures are followed due to the high voltage ratings and sensitive semiconductor materials used in the module construction.

FET, MOSFET Arrays Selection Notes

Select this module when designing multiphase or semi-bridgeless PFC stages requiring high efficiency and compact form factors. The integrated SiC diodes offer improved performance over traditional silicon alternatives. Consider the thermal resistance values and maximum case temperature limits when designing the heat sinking solution. Verify compatibility with the intended gate drive voltages and switching frequencies to ensure optimal operation within the specified safe operating area.

FET, MOSFET Arrays Part Context

This component belongs to the FAM65 series from onsemi's EliteSiC product line, specifically tailored for automotive power electronics. It is part of the APM16 module family, which offers various configurations for different power conversion topologies. The FAM65CR51ADZ1 is distinct from similar parts like the FAM65CR51ADZ2 primarily by its lead forming shape and package variant, while sharing core electrical characteristics and application targets.

FET, MOSFET Arrays Replacement Considerations

The FAM65CR51ADZ2 serves as a direct alternative within the same series, differing mainly in lead forming geometry (L-shape vs. Y-shape). Ensure mechanical fitment on the PCB is compatible before substitution. Other potential replacements should be evaluated based on matching voltage ratings, current capabilities, and thermal performance metrics.

FAM65CR51ADZ1FAM65CR51ADZ1
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