FD900R12IP4DVBOSA1

$393.18

Description：IGBT MOD 1200V 900A 5100W
Series：PrimePACK™2

SKU:c5d89fbd0413 Category: IGBT Modules Brand: Infineon Technologies

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Product introduction

Product Detailed Parameters

Description：IGBT MOD 1200V 900A 5100W
Series：PrimePACK™2
Mfr：Infineon Technologies
Package：Bulk,Tray
IGBT Type：Trench Field Stop
Configuration：Single
Vce(on) (Max) @ Vge, Ic：2.05V @ 15V, 900A
Input：Standard
NTC Thermistor：Yes
Operating Temperature：-40°C ~ 150°C
Mounting Type：Chassis Mount
Package / Case：Module
Supplier Device Package：Module
Voltage - Collector Emitter Breakdown (Max)：1200 V
Current - Collector (Ic) (Max)：900 A
Power - Max：5100 W
Current - Collector Cutoff (Max)：5 mA
Input Capacitance (Cies) @ Vce：54 nF @ 25 V

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FD900R12IP4DVBOSA1

Overview

The FD900R12IP4DV is a PrimePACK™2 IGBT module utilizing Trench/Fieldstop IGBT4 technology with an enlarged Emitter Controlled 4 diode. It features a collector-emitter voltage (VCES) of 1200 V and a nominal continuous DC collector current (IC nom) of 900 A at TC = 100°C. The repetitive peak collector current (ICRM) reaches 1800 A for 1 ms pulses. Total power dissipation (Ptot) is rated at 5,10 kW at TC = 25°C. The module includes an integrated NTC thermistor with a rated resistance (R25) of 5.00 kΩ at 25°C. It provides 4 kV AC insulation for 1 minute and operates within a junction temperature range of -40°C to 150°C.

Feature Summary

High short circuit capability with self-limiting short circuit current
Low VCEsat with positive temperature coefficient
Extended operation temperature range up to 175°C maximum junction temperature
High DC stability and high power density

Applications

Hybrid commercial vehicles
Commercial agriculture vehicles

Procurement Notes

Verify the specific ordering suffix against official Infineon documentation to confirm exact configuration details. Confirm RoHS compliance status and check for any preliminary data disclaimers in the latest datasheet revision before finalizing procurement specifications.

Selection Notes

Select this module for applications requiring high current handling and robust short-circuit protection. Ensure thermal management design accounts for the specified RthJC values. Verify that the gate drive circuitry supports the required VGE levels and internal gate resistor characteristics for optimal switching performance.

Part Context

This component belongs to the PrimePACK™2 series from Infineon Technologies. It integrates Trench/Fieldstop IGBT4 technology with an enlarged diode structure. The module is designed for industrial applications demanding high power density and reliable thermal cycling performance.