FET, MOSFET Arrays FDMB2307NZ product image

FDMB2307NZ

$1.20
  • Description:MOSFET 2N-CH 6MLP
  • Series:PowerTrench®

SKU:17ace35f4dac Category: Brand:

  
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FDMB2307NZ is listed in the FET, MOSFET Arrays range at ChipApex. The manufacturer field lists onsemi. Its product description is MOSFET 2N-CH 6MLP. Review the specifications below when checking this part for your BOM.

FET, MOSFET Arrays specifications for FDMB2307NZ

  • Description:MOSFET 2N-CH 6MLP
  • Series:PowerTrench®
  • Mfr:onsemi
  • Package:Tape & Reel (TR),Cut Tape (CT)
  • Technology:MOSFET (Metal Oxide)
  • Configuration:2 N-Channel (Dual) Common Drain
  • FET Feature:Logic Level Gate
  • Drain to Source Voltage (Vdss):-
  • Current - Continuous Drain (Id) @ 25°C:-
  • Rds On (Max) @ Id, Vgs:-
  • Vgs(th) (Max) @ Id:-
  • Gate Charge (Qg) (Max) @ Vgs:28nC @ 5V
  • Input Capacitance (Ciss) (Max) @ Vds:-
  • Power - Max:800mW
  • Operating Temperature:-55°C ~ 150°C (TJ)
  • Mounting Type:Surface Mount
  • Package / Case:6-WDFN Exposed Pad
  • Supplier Device Package:6-MLP (2x3)
  • Grade:-
  • Qualification:-

FET, MOSFET Arrays datasheet and documents for FDMB2307NZ

FDMB2307NZ

FET, MOSFET Arrays Overview

The onsemi FDMB2307NZ is an N-channel enhancement mode MOSFET from the PowerTrench series, housed in a surface-mount MLP package with six pins. It features a maximum drain-source voltage of 20 V and a continuous drain current of 8 A. The device exhibits a maximum on-resistance of 16.5 mΩ and a typical gate charge of 18 nC at 4.5 V. Operating within a temperature range of -55 °C to +150 °C, it dissipates up to 2.2 W of power. The component utilizes silicon technology and includes two chips per unit.

FET, MOSFET Arrays Feature Summary

  • PowerTrench series construction for optimized low-voltage performance
  • Six-pin MLP surface-mount configuration for compact integration
  • Enhanced channel mode operation for efficient switching control

FET, MOSFET Arrays Applications

  • Low voltage DC-DC converter circuits
  • Load switching applications requiring high current density
  • Battery protection and management systems

FET, MOSFET Arrays Procurement Notes

Verify the manufacturer designation as Fairchild Semiconductor or onsemi depending on the production era, as corporate transitions occurred. Confirm the MLP package dimensions match the specific footprint requirements of the target PCB design. Ensure the ordering suffix corresponds to the desired tape and reel quantity if applicable for automated assembly processes.

FET, MOSFET Arrays Selection Notes

Select this component when a low-profile solution is required for 20 V systems demanding up to 8 A continuous current. The 16.5 mΩ on-resistance supports efficient power handling in space-constrained designs. Evaluate thermal management needs based on the 2.2 W power dissipation rating and the thermal characteristics of the MLP package for the specific application environment.

FET, MOSFET Arrays Part Context

This part belongs to the PowerTrench family, which focuses on minimizing on-state resistance through advanced trench technology. The MLP package provides a small outline suitable for dense board layouts. As a product originally developed by Fairchild Semiconductor and later integrated into onsemi's portfolio, it represents a standard solution for low-voltage power management tasks.

FET, MOSFET Arrays Replacement Considerations

Publicly confirmed substitute part numbers are not available in the provided documentation. Verify pinout compatibility and electrical specifications before considering alternative components from other manufacturers.

FDMB2307NZFDMB2307NZ
$1.20
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