FET, MOSFET Arrays FDMD8900 product image

FDMD8900

$0.68
  • Description:MOSFET 2N-CH 30V 19A/17A 12POWER
  • Series:-

SKU:cb7756a69c84 Category: Brand:

  
  • Quantity
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FDMD8900 is listed in the FET, MOSFET Arrays range at ChipApex. The manufacturer field lists onsemi. Its product description is MOSFET 2N-CH 30V 19A/17A 12POWER. Review the specifications below when checking this part for your BOM.

FET, MOSFET Arrays specifications for FDMD8900

  • Description:MOSFET 2N-CH 30V 19A/17A 12POWER
  • Series:-
  • Mfr:onsemi
  • Package:Tape & Reel (TR),Tape & Reel (TR)
  • Technology:MOSFET (Metal Oxide)
  • Configuration:2 N-Channel (Dual)
  • FET Feature:-
  • Drain to Source Voltage (Vdss):30V
  • Current - Continuous Drain (Id) @ 25°C:19A, 17A
  • Rds On (Max) @ Id, Vgs:4mOhm @ 19A, 10V
  • Vgs(th) (Max) @ Id:2.5V @ 250µA
  • Gate Charge (Qg) (Max) @ Vgs:35nC @ 10V
  • Input Capacitance (Ciss) (Max) @ Vds:2605pF @ 15V
  • Power - Max:2.1W
  • Operating Temperature:-55°C ~ 150°C (TJ)
  • Mounting Type:Surface Mount
  • Package / Case:12-PowerWDFN
  • Supplier Device Package:12-Power3.3x5
  • Grade:-
  • Qualification:-

FET, MOSFET Arrays datasheet and documents for FDMD8900

FDMD8900

FET, MOSFET Arrays Overview

The FDMD8900 is a dual N-channel Power Trench MOSFET module manufactured by onsemi. It integrates two independent N-channel MOSFETs within a single package, designed for high-efficiency power switching applications. The device utilizes advanced trench technology to achieve low on-resistance and fast switching speeds. Key electrical characteristics include a drain-source voltage rating of 30V and a gate-source voltage limit of ±12V. This configuration allows for compact circuit designs in synchronous rectification and load switch applications where space efficiency and thermal performance are critical.

FET, MOSFET Arrays Feature Summary

  • Dual N-channel configuration integrating two independent MOSFETs in one package
  • Power Trench MOSFET technology for enhanced switching performance
  • Designed for high-efficiency power management and synchronous rectification

FET, MOSFET Arrays Applications

  • Synchronous rectification in DC-DC converters
  • Load switch applications requiring dual channel control
  • Power management modules for portable electronics

FET, MOSFET Arrays Procurement Notes

Verify the specific package variant and tape-and-reel quantity against the official onsemi datasheet before ordering. Confirm that the requested part number matches the exact pinout and thermal specifications required for your PCB layout. Ensure compliance with RoHS directives if applicable to your manufacturing region. Cross-reference the manufacturer's latest documentation to confirm current production status and any potential obsolescence notices prior to finalizing procurement.

FET, MOSFET Arrays Selection Notes

Select the FDMD8900 when a dual N-channel MOSFET solution is required for space-constrained designs. Evaluate the total on-resistance and thermal resistance parameters against your system's power dissipation requirements. Consider the 30V drain-source voltage rating to ensure adequate headroom for your operating voltage. Verify that the ±12V gate-source voltage limit aligns with your driver circuit capabilities to prevent device damage during operation.

FET, MOSFET Arrays Part Context

The FDMD8900 belongs to onsemi's portfolio of discrete semiconductor devices, specifically within the MOSFET module category. It complements other power switching components by offering integrated dual-channel functionality. This product line supports various power management architectures used in consumer electronics and industrial equipment. The device represents onsemi's commitment to providing efficient, compact solutions for modern power conversion challenges through advanced silicon trench technology.

FET, MOSFET Arrays Replacement Considerations

Consult onsemi's official substitution guide or contact technical support for verified equivalent parts. Compare key parameters such as Rds(on), Vds, and package dimensions before considering alternatives. Generic cross-references may not guarantee identical thermal or electrical performance. Ensure any substitute component meets the same safety and reliability standards required for your specific application.

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