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FDMS001N025DSD is listed in the FET, MOSFET Arrays range at ChipApex. The manufacturer field lists onsemi. Its product description is MOSFET 2N-CH 25V 19A 8PQFN. Review the specifications below when checking this part for your BOM.
FET, MOSFET Arrays specifications for FDMS001N025DSD
- Description：MOSFET 2N-CH 25V 19A 8PQFN
- Series：PowerTrench®
- Mfr：onsemi
- Package：Tape & Reel (TR),Tape & Reel (TR),Bulk
- Technology：MOSFET (Metal Oxide)
- Configuration：2 N-Channel (Dual) Asymmetrical
- FET Feature：-
- Drain to Source Voltage (Vdss)：25V
- Current - Continuous Drain (Id) @ 25°C：19A (Ta), 69A (Tc), 38A (Ta), 165A (Tc)
- Rds On (Max) @ Id, Vgs：3.25mOhm @ 19A, 10V, 0.92mOhm @ 38A, 10V
- Vgs(th) (Max) @ Id：2.5V @ 320µA, 3V @ 1mA
- Gate Charge (Qg) (Max) @ Vgs：30nC @ 10V, 104nC @ 10V
- Input Capacitance (Ciss) (Max) @ Vds：1370pF @ 13V, 5105pF @ 13V
- Power - Max：2.1W (Ta), 26W (Tc), 2.3W (Ta), 42W (Tc)
- Operating Temperature：-55°C ~ 150°C (TJ)
- Mounting Type：Surface Mount
- Package / Case：8-PowerWDFN
- Supplier Device Package：8-PQFN (5x6)
- Grade：-
- Qualification：-
FET, MOSFET Arrays datasheet and documents for FDMS001N025DSD
FET, MOSFET Arrays Overview
The FDMS001N025DSD is a PowerTrench Power Clip asymmetric dual N-channel MOSFET manufactured by onsemi. This component integrates two independent N-channel power switches within a single package, designed for high-efficiency power management applications. The device utilizes Shielded Gate technology to achieve low on-resistance and fast switching speeds. It features an asymmetric configuration, allowing for optimized performance in bridge or half-bridge topologies where distinct upper and lower switch characteristics are required.
FET, MOSFET Arrays Feature Summary
- Asymmetric dual N-channel architecture for flexible circuit design
- Shielded Gate PowerTrench technology for enhanced efficiency
- Power Clip package for superior thermal dissipation
FET, MOSFET Arrays Applications
- DC-DC converter modules
- Motor control circuits
- Load switch applications
FET, MOSFET Arrays Part Context
This part belongs to the FDMS series of PowerTrench MOSFETs from onsemi. The series is characterized by the use of advanced planar trench technology and the distinctive Power Clip packaging, which provides a large copper tab for direct soldering to PCB ground planes to minimize thermal resistance.
FET, MOSFET Arrays Replacement Considerations
Verify pinout compatibility and thermal requirements when substituting. Ensure the replacement device supports the specific voltage and current ratings of the original design. Check datasheet parameters such as RDS(on) and gate charge for electrical equivalence.
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