FDPC8016S-B801

FET, MOSFET Arrays Overview

The FDPC8016S-B801 is a dual N-channel asymmetric MOSFET module manufactured by ON Semiconductor, formerly Fairchild Semiconductor. It integrates a low-side synchronous FET and a control FET within a compact Power Clip package. The device utilizes PowerTrench technology to achieve low on-resistance, with the sync FET offering typical RDS(on) of 1.4mΩ and the control FET at 5.4mΩ at VGS=4.5V. Designed for high-density DC-DC converters, it supports output currents exceeding 25A. The component operates within a temperature range of -55°C to 150°C junction temperature and is housed in a lead-free QFN-16 package measuring 3x3mm.

FET, MOSFET Arrays Feature Summary

• Integrates asymmetric dual N-channel MOSFETs in a single low-inductance Power Clip package
• Optimized for synchronous buck applications to reduce component count and PCB area
• Features source-down configuration for improved thermal performance and simplified layout
• Designed to minimize switching losses through reduced parasitic inductance

FET, MOSFET Arrays Applications

• High-density embedded DC-DC power supplies
• Synchronous buck converter circuits
• Portable electronic devices requiring efficient power management
• Server and storage system power distribution networks

FET, MOSFET Arrays Procurement Notes

Verify the manufacturer origin, as the part was originally developed by Fairchild Semiconductor and is now produced by ON Semiconductor. Confirm the specific suffix B801 corresponds to the required tape and reel packaging configuration. Ensure the component meets RoHS compliance standards if required by your manufacturing process. Cross-reference the datasheet revision date to confirm technical specifications have not changed. Validate that the 3x3mm QFN-16 footprint matches your board design constraints.

FET, MOSFET Arrays Selection Notes

Select this component when space-constrained designs require high current capacity in a minimal footprint. The asymmetric configuration allows for optimized efficiency in synchronous rectification applications. Consider the low thermal resistance of the Power Clip package for heat dissipation requirements. Evaluate the gate charge characteristics against your driver capabilities to ensure adequate switching speeds. Compare total on-resistance values against alternative packages to determine overall system efficiency benefits.

FET, MOSFET Arrays Part Context

This device belongs to the PowerTrench Power Clip series, which focuses on minimizing package parasitics for high-frequency switching applications. The series includes various voltage ratings and current capacities, with the FDPC8016S representing a 25V rating variant. It complements other asymmetric dual MOSFETs like the FDPC8011S and FDPC8012S, offering different RDS(on) trade-offs for specific efficiency and cost targets.

FET, MOSFET Arrays Replacement Considerations

Potential substitutes include the FDPC8011S or FDPC8012S from the same product family, though these may have different on-resistance values. Verify pin compatibility and thermal characteristics before substitution. Other manufacturers offer similar asymmetric dual MOSFETs in QFN packages, but direct pin-to-pin replacements must be confirmed via official cross-reference tools.