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FDPF9N50NZ-FS is listed in the FET, MOSFET Arrays range at ChipApex. The manufacturer field lists Fairchild Semiconductor. Its product description is MOSFET N-CH 500V. Review the specifications below when checking this part for your BOM.
The FDPF9N50NZ-FS is a power N-channel MOSFET from the UniFET-II series, manufactured by Fairchild Semiconductor. It features a drain-source voltage (Vdss) of 500 V and a continuous drain current (Id) rated at 6.5 A under case conditions. The device exhibits a maximum on-resistance (Rds On) of 1.2 Ohms at 4 A and 10 V gate drive. Key electrical parameters include a maximum gate charge (Qg) of 18 nC at 10 V and an input capacitance (Ciss) of 735 pF at 25 V. The component supports a maximum gate-source voltage (Vgs) of ±25 V and dissipates up to 40 W of power in a TO-220F-3 package.
Verify the specific suffix 'FS' against the manufacturer's official documentation to confirm packaging configuration and compliance status. Ensure that the component matches the required pinout and thermal pad specifications for your PCB layout. Cross-reference the datasheet revision date to validate parameter accuracy before finalizing procurement orders.
Select this component when a 500 V rating and 6.5 A current capacity are required in a through-hole package. Consider the 1.2 Ohm on-resistance for conduction loss calculations. Evaluate the 40 W power dissipation capability relative to your thermal management strategy. Compare gate charge requirements against your driver capabilities for optimal switching efficiency.
This part belongs to the UniFET-II family, representing Fairchild's first-generation super-junction MOSFETs. These devices utilize charge balance technology to achieve superior performance compared to conventional planar structures. The FDPF9N50NZ-FS variant specifically targets applications requiring robust high-voltage switching with improved thermal handling in standard industrial packages.
Consult official substitution lists for equivalents within the UniFET-II series. Verify compatibility with alternative manufacturers offering similar super-junction technologies. Ensure that any substitute maintains identical pin configurations and thermal resistance values to preserve system reliability.
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