FF11MR12W2M1HB70BPSA1

$92.74

Description：LOW POWER EASY
Series：-

SKU:bf19e9bf97c6 Category: IGBT Modules Brand: Infineon Technologies

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Product introduction

Product Detailed Parameters

Description：LOW POWER EASY
Series：-
Mfr：Infineon Technologies
Package：Tray
IGBT Type：-
Configuration：-
Vce(on) (Max) @ Vge, Ic：-
Input：-
NTC Thermistor：-
Operating Temperature：-
Mounting Type：-
Package / Case：-
Supplier Device Package：-
Voltage - Collector Emitter Breakdown (Max)：-
Current - Collector (Ic) (Max)：-
Power - Max：-
Current - Collector Cutoff (Max)：-
Input Capacitance (Cies) @ Vce：-

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FF11MR12W2M1HB70BPSA1

Overview

The FF11MR12W2M1HB70BPSA1 is a CoolSiC Trench MOSFET module in the EasyPACK™ package. It features a 1200 V drain-source voltage and a continuous DC drain current of 75 A at 175 °C junction temperature. The typical on-resistance is 10.8 mΩ at 25 °C. The module utilizes an AlN substrate for low thermal resistance and incorporates PressFIT contact technology with integrated mounting clamps. An internal NTC thermistor provides temperature monitoring, rated at 5 kΩ at 25 °C.

Feature Summary

Low inductive design with minimal stray inductance
AlN substrate providing low thermal resistance
PressFIT contact technology for robust mounting
Integrated NTC temperature sensor

Applications

High-frequency switching applications
DC/DC converters
Motor drives
UPS systems
EV DC chargers

Procurement Notes

Verify component authenticity by checking the Data Matrix barcode against Infineon standards. Confirm the revision history matches the latest datasheet version to ensure accurate electrical parameters. Ensure the ordering suffix aligns with specific packaging or testing requirements before finalizing procurement orders.

Selection Notes

Select this module for designs requiring high switching frequencies and low conduction losses. Verify that the gate drive voltages remain within the recommended range of -5 to 0 V off-state and 15 to 18 V on-state. Ensure the thermal management system can handle the specified thermal resistance values under maximum load conditions.

Part Context

This component belongs to the Infineon CoolSiC™ Trench MOSFET family. It is part of the EasyPACK™ series designed for industrial applications. The module integrates advanced silicon carbide technology to improve efficiency in power conversion systems compared to traditional silicon-based alternatives.

Replacement Considerations

Direct replacements must match the 1200 V rating, 75 A current capacity, and EasyPACK™ form factor. Verify compatibility with existing PCB footprints and cooling solutions. Check if alternative modules offer similar thermal resistance and switching characteristics for seamless integration.

How to buy

Online and offline orders are supported. If the item is available for online purchase, you can place it in the cart; for wholesale pricing, please contact our product manager for a quote.

Payment Method

Payment methods: T/T, WeChat Pay, credit cards, Google Pay, Apple Pay . Buyer covers shipping, fees, duties, and taxes; contact our product manager if you need a contract/procurement process.

Delivery time

In-stock items usually ship within 24 hours. Otherwise, shipment is arranged 1 to 2 days after the items arrive at our warehouse. Timing depends on destination and shipping method.

Freight calculation

Freight cost depends on destination, package size, and weight . We offer shipping options via DHL, FedEx, UPS, and TNT , and can ship using your freight account upon request.

Mode of Transportation

We ship via DHL, FedEx, UPS, and TNT. If you prefer a specific logistics provider, we can ship using your designated carrier.

Return and Refund

Returns are accepted within 60 days of invoice with RMA approval. Items must be resalable; original invoice and test report are required. No returns for customer errors.