FF1200XTR17T2P5PBPSA1

FF1200XTR17T2P5PBPSA1

$816.69
  • Description:XHP LV
  • Series:XHP™2

SKU:04fa0328ad29 Category: Brand:

  
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Product Detailed Parameters

  • Description:XHP LV
  • Series:XHP™2
  • Mfr:Infineon Technologies
  • Package:Tray
  • IGBT Type:Trench Field Stop
  • Configuration:Half Bridge Inverter
  • Vce(on) (Max) @ Vge, Ic:2.25V @ 15V, 1.2kA
  • Input:Standard
  • NTC Thermistor:Yes
  • Operating Temperature:-40°C ~ 175°C (TJ)
  • Mounting Type:Chassis Mount
  • Package / Case:Module
  • Supplier Device Package:Module
  • Voltage - Collector Emitter Breakdown (Max):1700 V
  • Current - Collector (Ic) (Max):1200 A
  • Power - Max:1200000 W
  • Current - Collector Cutoff (Max):10 mA
  • Input Capacitance (Cies) @ Vce:56000 pF @ 25 V

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FF1200XTR17T2P5PBPSA1

Overview

The FF1200XTR17T2P5PBPSA1 is a dual IGBT module utilizing Trench/Fieldstop IGBT5 technology with emitter-controlled diodes. It features a maximum collector-emitter voltage of 1700 V and a nominal continuous DC collector current of 1200 A at 25°C, extending to 1070 A at a junction temperature of 175°C. The device supports a repetitive peak collector current of 2400 A and operates within a junction temperature range of -40°C to 175°C. Integrated into an XHP™2 package, it includes a pre-applied thermal interface material and an NTC thermistor for monitoring.

Feature Summary

  • Incorporates Trench/Fieldstop IGBT5 technology combined with emitter-controlled diodes to achieve low switching losses and high current density.
  • Features an extended operating junction temperature capability up to 175°C alongside high power and thermal cycling performance.
  • Includes a built-in NTC thermistor for real-time temperature monitoring and utilizes pre-applied thermal interface material for simplified assembly.

Applications

  • High-power converters
  • Motor drives
  • Traction drives
  • Wind turbines

Procurement Notes

Verify the specific ordering suffix against official Infineon documentation to confirm exact configuration details. Ensure compliance with industrial qualification standards such as IEC 60747, 60749, and 60068 before integration. Confirm that the application environment aligns with the specified insulation coordination and mounting torque requirements outlined in the datasheet.

Selection Notes

Select this component for applications requiring high current density and robust thermal cycling capabilities. Consider the 1700 V rating and 1200 A nominal current when designing systems for traction or wind energy. Verify that the gate drive circuitry accommodates the specified internal gate resistance and charge characteristics for optimal switching performance.

Part Context

This module belongs to the XHP™2 series from Infineon Technologies, designed for demanding industrial power electronics. It represents an evolution in IGBT5 technology, offering improved efficiency and reliability compared to previous generations. The product is specifically engineered for high-power applications where compact size and high thermal performance are critical design constraints.

Replacement Considerations

Publicly confirmed substitute part numbers are not available in the provided source material. Consult official Infineon cross-reference guides for potential alternatives.

FAQ

What is the maximum allowable baseplate operation temperature?

The maximum baseplate operation temperature (TBPmax) is 150°C.

Does this module support automotive qualification standards?

No, the product is not qualified according to the AEC Q100 or AEC Q101 documents of the Automotive Electronics Council.

What is the typical rated resistance of the integrated NTC thermistor?

The rated resistance (R25) of the NTC thermistor at 25°C is typically 5 kΩ.

FF1200XTR17T2P5PBPSA1FF1200XTR17T2P5PBPSA1
$816.69
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