FF1500R17IP5BPSA1

Overview

The FF1500R17IP5BPSA1 is a dual IGBT module from Infineon Technologies, part of the Trenchstop IGBT5 - P5 series. It features a 1.7 kV collector-emitter maximum voltage (VCEO) and a continuous collector current of 1.5 kA at 25°C. The device exhibits a collector-emitter saturation voltage of 1.75 V and a gate-emitter leakage current of 400 nA. Power dissipation is rated at 1.5 MW. Operating temperatures range from -40°C to +175°C. The module utilizes silicon technology and is housed in a PrimePACK™ package.

Feature Summary

• Dual configuration integrating two independent IGBTs within a single unit for compact power circuit design.
• Trenchstop IGBT5 technology providing optimized switching characteristics and conduction losses.
• High thermal robustness with a maximum junction temperature rating of +175°C.

Applications

• Industrial motor drives requiring high current capacity
• Medium voltage power conversion systems
• Uninterruptible power supply (UPS) units

Procurement Notes

Verify the specific suffix BPSA1 against official Infineon documentation to confirm exact manufacturing lot details and compliance status. Cross-reference the Mouser number 726-FF1500R17IP5PBPSA1 for accurate sourcing channels. Ensure compatibility with existing thermal management solutions given the 1.5 MW power dissipation rating. Confirm RoHS compliance requirements prior to final procurement decisions.

Selection Notes

Select this component for applications demanding high current handling up to 1.5 kA at 1.7 kV blocking voltage. Evaluate thermal interface materials suitable for the PrimePACK™ housing to maintain junction temperatures below +175°C. Compare against similar Trenchstop IGBT5 variants if different current ratings or packaging options are required for space-constrained designs.

Part Context

This module belongs to the Trenchstop IGBT5 family, specifically utilizing the PrimePACK™ form factor. It represents a high-power discrete solution designed for industrial environments. The dual configuration allows for half-bridge or full-bridge topologies without requiring external parallel connections, enhancing reliability in high-current applications.

Replacement Considerations

Consult official Infineon substitution guides for compatible alternatives. Verify pinout and thermal footprint compatibility before replacing with other PrimePACK™ modules. Ensure electrical parameters such as VCEO and IC match the original design requirements when considering cross-series replacements.