FF150R12YT3BOMA1

Description：IGBT MOD 1200V 200A 625W
Series：-

SKU:1cbaeee8833a Category: IGBT Modules Brand: Infineon Technologies

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Product introduction

Product Detailed Parameters

Description：IGBT MOD 1200V 200A 625W
Series：-
Mfr：Infineon Technologies
Package：Tray
IGBT Type：-
Configuration：2 Independent
Vce(on) (Max) @ Vge, Ic：2.15V @ 15V, 150A
Input：Standard
NTC Thermistor：Yes
Operating Temperature：-40°C ~ 125°C
Mounting Type：Chassis Mount
Package / Case：Module
Supplier Device Package：Module
Voltage - Collector Emitter Breakdown (Max)：1200 V
Current - Collector (Ic) (Max)：200 A
Power - Max：625 W
Current - Collector Cutoff (Max)：1 mA
Input Capacitance (Cies) @ Vce：10.5 nF @ 25 V

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FF150R12YT3BOMA1

Overview

The FF150R12YT3BOMA1 is a dual IGBT module from Infineon Technologies, rated for 1200V and 200A. It utilizes Trench/Fieldstop technology within a chassis mount package. The module features an integrated NTC thermistor for thermal monitoring and employs CoolSiC Schottky diodes to enhance efficiency and reliability in high-power applications.

Feature Summary

Integrates CoolSiC Schottky diodes for improved switching performance
Includes built-in NTC thermistor for precise temperature monitoring
Utilizes Trench/Fieldstop IGBT technology for low conduction losses

Applications

Industrial motor drives
Uninterruptible power supplies (UPS)
Welding inverters

Procurement Notes

Verify the exact suffix against official datasheets to confirm technical specifications. Ensure compatibility with existing cooling systems due to chassis mount requirements. Confirm availability status as supply chain conditions may vary for this component type.

Selection Notes

Select this module for applications requiring high current density and efficient thermal management. The integrated NTC simplifies protection circuit design. Consider the chassis mount style for mechanical integration and heat dissipation needs compared to screw-mount alternatives.

Part Context

This component belongs to Infineon's high-performance IGBT module series. It represents an evolution in power semiconductor packaging, combining advanced chip technology with robust mechanical design for demanding industrial environments.