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— IC芯片 | 连接器 | 传感器 | 被动器件 —
The FF1800R23IE7BPSA1 is a dual IGBT module from Infineon Technologies, utilizing TRENCHSTOP IGBT7 technology. It features a collector-emitter voltage of 2300 V and a nominal continuous collector current of 1800 A at 25°C. The device supports short-term overload operation up to 3600 A. It operates within a junction temperature range of -40°C to +150°C for standard operation, with capability up to 175°C during overload conditions.
Verify the specific suffix BPSA1 against official Infineon documentation to confirm packaging and handling specifications. Ensure compatibility with existing thermal interface materials and mounting hardware requirements for the PrimePACK 3+ form factor before integration into system designs.
Select this component for systems requiring robust 2300 V blocking capability and high current density. Consider the thermal resistance characteristics inherent to the PrimePACK 3+ design when calculating heatsink requirements. Evaluate the trade-off between the lower CR-FIT rate and system reliability targets compared to previous generation technologies.
This module belongs to the TRENCHSTOP IGBT7 family, representing an evolution in silicon gate technology. It shares the PrimePACK 3+ mechanical footprint with other high-power modules in the series, facilitating potential design continuity while offering improved electrical performance over older generations like IGBT5.
Direct substitutes include FF1800R23IE7. Verify pinout and thermal characteristics when replacing older variants such as those from the IGBT5 series to ensure mechanical and electrical compatibility.