FF1800R23IE7BPSA1

FF1800R23IE7BPSA1

$1,396.13
  • Description:PP IHM I XHP 2.3KV AG-PRIME3+-7
  • Series:PrimePACK™3+ B

SKU:bd1e16bc7ec6 Category: Brand:

  
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Product Detailed Parameters

  • Description:PP IHM I XHP 2.3KV AG-PRIME3+-7
  • Series:PrimePACK™3+ B
  • Mfr:Infineon Technologies
  • Package:Tray
  • IGBT Type:-
  • Configuration:2 Independent
  • Vce(on) (Max) @ Vge, Ic:2.26V @ 15V, 1.8kA
  • Input:Standard
  • NTC Thermistor:No
  • Operating Temperature:-40°C ~ 150°C (TJ)
  • Mounting Type:Chassis Mount
  • Package / Case:Module
  • Supplier Device Package:AG-PRIME3+
  • Voltage - Collector Emitter Breakdown (Max):2300 V
  • Current - Collector (Ic) (Max):1800 A
  • Power - Max:-
  • Current - Collector Cutoff (Max):30 mA
  • Input Capacitance (Cies) @ Vce:420 nF @ 25 V

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FF1800R23IE7BPSA1

Overview

The FF1800R23IE7BPSA1 is a dual IGBT module from Infineon Technologies, utilizing TRENCHSTOP IGBT7 technology. It features a collector-emitter voltage of 2300 V and a nominal continuous collector current of 1800 A at 25°C. The device supports short-term overload operation up to 3600 A. It operates within a junction temperature range of -40°C to +150°C for standard operation, with capability up to 175°C during overload conditions.

Feature Summary

  • Incorporates TRENCHSTOP IGBT7 technology for optimized switching performance
  • Designed for high-current applications with 1800 A nominal rating
  • Supports short-term overload currents up to 3600 A
  • Utilizes PrimePACK 3+ package for efficient thermal management

Applications

  • Industrial motor drives
  • Uninterruptible power supplies (UPS)
  • Medium voltage variable frequency drives

Procurement Notes

Verify the specific suffix BPSA1 against official Infineon documentation to confirm packaging and handling specifications. Ensure compatibility with existing thermal interface materials and mounting hardware requirements for the PrimePACK 3+ form factor before integration into system designs.

Selection Notes

Select this component for systems requiring robust 2300 V blocking capability and high current density. Consider the thermal resistance characteristics inherent to the PrimePACK 3+ design when calculating heatsink requirements. Evaluate the trade-off between the lower CR-FIT rate and system reliability targets compared to previous generation technologies.

Part Context

This module belongs to the TRENCHSTOP IGBT7 family, representing an evolution in silicon gate technology. It shares the PrimePACK 3+ mechanical footprint with other high-power modules in the series, facilitating potential design continuity while offering improved electrical performance over older generations like IGBT5.

Replacement Considerations

Direct substitutes include FF1800R23IE7. Verify pinout and thermal characteristics when replacing older variants such as those from the IGBT5 series to ensure mechanical and electrical compatibility.

FF1800R23IE7BPSA1FF1800R23IE7BPSA1
$1,396.13
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