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Product Detailed Parameters
- Description：XHP LV
- Series：XHP™2
- Mfr：Infineon Technologies
- Package：Tray
- IGBT Type：Trench Field Stop
- Configuration：Half Bridge Inverter
- Vce(on) (Max) @ Vge, Ic：2.25V @ 15V, 1.8kA
- Input：Standard
- NTC Thermistor：Yes
- Operating Temperature：-40°C ~ 175°C (TJ)
- Mounting Type：Chassis Mount
- Package / Case：Module
- Supplier Device Package：Module
- Voltage - Collector Emitter Breakdown (Max)：1700 V
- Current - Collector (Ic) (Max)：1800 A
- Power - Max：1800000 W
- Current - Collector Cutoff (Max)：10 mA
- Input Capacitance (Cies) @ Vce：84000 pF @ 25 V
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Overview
The FF1800XTR17T2P5BPSA1 is an XHP™2 IGBT module featuring Trench/Fieldstop IGBT5 technology and emitter-controlled diodes. It provides a collector-emitter voltage of 1700 V, nominal current of 1800 A, and peak current of 3600 A. The saturation voltage is 1.8 V at 25°C. Operating junction temperature reaches 175°C with thermal resistance of 20.6 K/kW for the IGBT and 39.1 K/kW for the diode. An integrated NTC thermistor has a rated resistance of 5 kΩ at 25°C.
Feature Summary
- High power density design utilizing XHP™2 packaging with superior creepage and clearance distances.
- Robust mechanical construction supporting high power cycling and thermal cycling capabilities.
- Integrated NTC thermistor for precise internal temperature monitoring.
- Qualified for industrial applications meeting IEC 60747, 60749, and 60068 standards.
Applications
- Motor drives
- Traction drives
- Wind turbines
- High-power converters
Procurement Notes
Verify component authenticity through official Infineon channels or authorized distributors. Confirm that the specific ordering suffix matches the required technical specifications. Ensure compliance with RoHS directives and check for REACH SVHC status prior to integration into final assemblies.
Selection Notes
Select this module for high-current industrial applications requiring robust thermal management. Evaluate the 175°C operating limit against system cooling requirements. Consider the low stray inductance and fast switching characteristics when designing gate drive circuits and PCB layouts for optimal performance.
Part Context
This component belongs to the XHP™2 series from Infineon Technologies. It utilizes advanced Trench/Fieldstop IGBT5 technology combined with emitter-controlled diodes. The package is designed for high power density and features a copper baseplate with high comparative tracking index insulation.
Replacement Considerations
Consult official Infineon documentation for qualified replacement part numbers. Verify compatibility regarding pinout configuration, thermal resistance values, and mechanical mounting dimensions before substituting components in existing designs.
