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Product Detailed Parameters
- Description：XHP LV
- Series：XHP™2
- Mfr：Infineon Technologies
- Package：Tray
- IGBT Type：Trench Field Stop
- Configuration：Half Bridge Inverter
- Vce(on) (Max) @ Vge, Ic：2.25V @ 15V, 1.8kA
- Input：Standard
- NTC Thermistor：Yes
- Operating Temperature：-40°C ~ 175°C (TJ)
- Mounting Type：Chassis Mount
- Package / Case：Module
- Supplier Device Package：Module
- Voltage - Collector Emitter Breakdown (Max)：1700 V
- Current - Collector (Ic) (Max)：1800 A
- Power - Max：1800000 W
- Current - Collector Cutoff (Max)：10 mA
- Input Capacitance (Cies) @ Vce：84000 pF @ 25 V
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Overview
The FF1800XTR17T2P5PBPSA1 is an XHP™2 IGBT module featuring Trench/Fieldstop IGBT5 technology with emitter-controlled diodes and integrated NTC thermistor. It provides a collector-emitter voltage of 1700 V, nominal current of 1800 A, and peak current of 3600 A. The device operates up to 175°C junction temperature with low saturation voltage (1.8 V typ at 25°C) and switching losses. Key electrical parameters include gate threshold voltage of 5.8 V typ, input capacitance of 84 nF, and thermal resistance of 31.3 K/kW for the IGBT.
Feature Summary
- Utilizes XHP™2 package design with high creepage and clearance distances for enhanced insulation safety.
- Incorporates pre-applied thermal interface material to simplify assembly and ensure consistent thermal performance.
- Features Trench/Fieldstop IGBT5 technology combined with emitter-controlled diodes for optimized switching characteristics.
- Includes integrated NTC thermistor for precise real-time junction temperature monitoring.
Applications
- Motor drives
- Traction drives
- Wind turbines
- High-power converters
Procurement Notes
Verify component authenticity by cross-referencing the Data Matrix barcode on the module label against Infineon records. Confirm that the ordering suffix matches the specific technical configuration required. Ensure compliance with export control regulations if applicable. Validate RoHS status through official documentation before procurement.
Selection Notes
Select this module for applications requiring high power density and robust thermal cycling capability. Consider the 1700 V rating for medium-voltage systems. Evaluate the pre-applied TIM requirements for heatsink compatibility. Verify that the mounting torque specifications align with the mechanical design constraints of the target application.
Part Context
This component belongs to the XHP™2 family from Infineon Technologies, designed for industrial power electronics. It represents an evolution in IGBT module packaging, focusing on improved reliability and ease of integration. The series targets demanding environments where high current handling and thermal management are critical.
Replacement Considerations
Direct substitutes within the same XHP™2 form factor should be evaluated based on matching voltage and current ratings. Verify pinout compatibility and thermal resistance values. Check for any differences in switching characteristics or gate drive requirements when considering alternative part numbers.
FAQ
What is the maximum operating junction temperature?
The maximum operating junction temperature (Tvj op) is 175°C.
Does the module include an NTC thermistor?
Yes, the module features an integrated NTC thermistor with a rated resistance of 5 kΩ at 25°C.
What is the typical collector-emitter saturation voltage?
The typical collector-emitter saturation voltage (VCE sat) is 1.80 V at 25°C with a collector current of 1800 A.
