FF3MR20W3M1HH11BPSA1

$428.43

Description：EASY STANDARD PLUS
Series：-

SKU:746803f5fa83 Category: FET, MOSFET Arrays Brand: Infineon Technologies

Consult the customer manager about the wholesale price.

consultation hotline：86-132-6715-2157

email：[email protected]
Contact the product manager for consultation. One-stop consultation is available.

Do you want a lower wholesale price? Please send us your inquiry and we will reply immediately.

Product introduction

FF3MR20W3M1HH11BPSA1 is listed in the FET, MOSFET Arrays range at ChipApex. The manufacturer field lists Infineon Technologies. Its product description is EASY STANDARD PLUS. Review the specifications below when checking this part for your BOM.

FET, MOSFET Arrays specifications for FF3MR20W3M1HH11BPSA1

Description：EASY STANDARD PLUS
Series：-
Mfr：Infineon Technologies
Package：Tray
Technology：-
Configuration：-
FET Feature：-
Drain to Source Voltage (Vdss)：-
Current - Continuous Drain (Id) @ 25°C：-
Rds On (Max) @ Id, Vgs：-
Vgs(th) (Max) @ Id：-
Gate Charge (Qg) (Max) @ Vgs：-
Input Capacitance (Ciss) (Max) @ Vds：-
Power - Max：-
Operating Temperature：-
Mounting Type：-
Package / Case：-
Supplier Device Package：-
Grade：-
Qualification：-

FET, MOSFET Arrays datasheet and documents for FF3MR20W3M1HH11BPSA1

FF3MR20W3M1HH11BPSA1

FET, MOSFET Arrays Overview

The FF3MR20W3M1HH11BPSA1 is a CoolSiC Trench MOSFET half-bridge module in the EasyPACK™ package. It features a 2000 V drain-source voltage and supports a continuous DC current of 275 A at 175 °C, with a repetitive peak current of 640 A. The on-resistance is typically 4.1 mΩ at 25 °C. The module utilizes press-fit contact technology and includes high-current pins for robust mounting. An integrated NTC thermistor provides temperature monitoring.

FET, MOSFET Arrays Feature Summary

Integrates CoolSiC Trench MOSFET technology for low switching losses and high current density.
Features press-fit contact technology combined with high-current pins for rugged mechanical mounting.
Includes an integrated NTC temperature sensor for thermal management.
Provides 3.2 kV AC insulation isolation between terminals.

FET, MOSFET Arrays Applications

Energy storage systems (ESS)
EV charging
UPS systems
Solar applications

FET, MOSFET Arrays Procurement Notes

Verify the specific ordering suffix against the manufacturer's official documentation to confirm exact electrical characteristics and pinout configuration. Ensure that the selected gate driver is compatible with the recommended operating voltages specified in the datasheet. Confirm compliance with industrial qualification standards required for the target application environment.

FET, MOSFET Arrays Selection Notes

Select this component for designs requiring high-voltage handling and efficient thermal performance in power conversion circuits. Consider the specific gate resistance requirements to optimize switching speeds and minimize losses. Evaluate the thermal resistance parameters to ensure adequate heat sinking solutions are implemented for sustained operation at elevated temperatures.

FET, MOSFET Arrays Part Context

This part belongs to Infineon's EasyPACK™ series of discrete semiconductor modules. It utilizes silicon carbide (SiC) technology within the CoolSiC™ product line. The module is designed for industrial applications and meets relevant IEC reliability standards for power electronics.

FET, MOSFET Arrays Replacement Considerations

Consult official Infineon documentation for verified substitute part numbers. Cross-referencing should be performed based on matching voltage ratings, current capabilities, and package dimensions.