Power Driver Modules FF55MR12W1M1HB70BPSA1 product image

FF55MR12W1M1HB70BPSA1

$53.85
  • Description:EASYDUAL MODULE WITH COOLSIC TRE
  • Series:-

SKU:992d60ef8626 Category: Brand:

  
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FF55MR12W1M1HB70BPSA1 is listed in the Power Driver Modules range at ChipApex. The manufacturer field lists Infineon Technologies. Its product description is EASYDUAL MODULE WITH COOLSIC TRE. Review the specifications below when checking this part for your BOM.

Power Driver Modules specifications for FF55MR12W1M1HB70BPSA1

  • Description:EASYDUAL MODULE WITH COOLSIC TRE
  • Series:-
  • Mfr:Infineon Technologies
  • Package:Tray
  • Type:-
  • Configuration:-
  • Current:-
  • Voltage:-
  • Voltage - Isolation:-
  • Mounting Type:-
  • Package / Case:-
  • Grade:-
  • Qualification:-

Power Driver Modules datasheet and documents for FF55MR12W1M1HB70BPSA1

FF55MR12W1M1HB70BPSA1

Power Driver Modules Overview

The FF55MR12W1M1HB70BPSA1 is an EasyDUAL module featuring CoolSiC Trench MOSFET technology with PressFIT and NTC integration. It provides a drain-source voltage of 1200 V, a continuous DC drain current of 15 A at 175 °C, and a repetitive peak current of 30 A. The device utilizes an AlN substrate for low thermal resistance and includes integrated mounting clamps. Electrical characteristics include a typical on-resistance of 52.9 mΩ at 25 °C and a gate threshold voltage ranging from 3.45 V to 5.15 V.

Power Driver Modules Feature Summary

  • Integrated CoolSiC Trench MOSFET technology for high-frequency switching applications
  • PressFIT contact technology combined with rugged integrated mounting clamps
  • AlN substrate design providing low thermal resistance and high isolation strength
  • Built-in NTC temperature sensor for precise thermal monitoring

Power Driver Modules Applications

  • High-frequency switching applications
  • DC/DC converters
  • Motor drives
  • UPS systems

Power Driver Modules Procurement Notes

Verify the specific ordering suffix against official Infineon documentation to confirm mechanical and electrical configurations. Ensure compatibility with PressFIT assembly processes and verify that the selected variant meets the required industrial qualification standards defined in IEC 60747, 60749, and 60068 before finalizing procurement.

Power Driver Modules Selection Notes

Select this component for designs requiring robust high-voltage switching with simplified mechanical assembly. The PressFIT interface eliminates soldering requirements, while the integrated NTC facilitates accurate junction temperature management. Consider the 1200 V rating and 15 A continuous current capability when sizing the thermal management system for the target operating environment.

Power Driver Modules Part Context

This part belongs to the Infineon EasyDUAL series, which integrates CoolSiC MOSFETs into compact modules. The M1H designation indicates specific packaging and terminal configurations within the lineup. These modules are engineered for industrial power electronics, combining silicon carbide performance with reliable mechanical mounting solutions for demanding environments.

Power Driver Modules Replacement Considerations

Consult official Infineon cross-reference documents for verified substitutes. Direct replacements must match the 1200 V rating, 15 A current capacity, and EasyDUAL form factor. Verify that any alternative maintains compatible PressFIT specifications and thermal resistance values.

FF55MR12W1M1HB70BPSA1FF55MR12W1M1HB70BPSA1
$53.85
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