FF600R12IS4FBOSA1

FF600R12IS4FBOSA1

$329.11
  • Description:PP, IHM I, XHP 1,7KV
  • Series:*

SKU:66c8867c1db9 Category: Brand:

  
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Product Detailed Parameters

  • Description:PP, IHM I, XHP 1,7KV
  • Series:*
  • Mfr:Infineon Technologies
  • Package:Bulk
  • IGBT Type:-
  • Configuration:-
  • Vce(on) (Max) @ Vge, Ic:-
  • Input:-
  • NTC Thermistor:-
  • Operating Temperature:-
  • Mounting Type:-
  • Package / Case:-
  • Supplier Device Package:-
  • Voltage - Collector Emitter Breakdown (Max):-
  • Current - Collector (Ic) (Max):-
  • Power - Max:-
  • Current - Collector Cutoff (Max):-
  • Input Capacitance (Cies) @ Vce:-

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FF600R12IS4FBOSA1

Overview

The FF600R12IS4FBOSA1 is a PrimePACK™2 IGBT module featuring fast IGBT2 technology and an integrated SiC diode. It provides a collector-emitter voltage (VCES) of 1200 V and a nominal continuous DC collector current (IC nom) of 600 A at TC = 55°C, with a repetitive peak collector current (ICRM) of 1200 A. The module incorporates an NTC thermistor for thermal monitoring. Key electrical parameters include a typical VCEsat of 3.20 V at Tvj = 25°C and a forward voltage (VF) of 1.60 V for the diode at 25°C. Total power dissipation reaches 3.70 kW at TC = 25°C. The package offers high insulation capabilities with a test voltage of 4 kV AC.

Feature Summary

  • Integrates fast IGBT2 chips with Silicon Carbide (SiC) diodes to minimize switching losses.
  • Includes an embedded NTC thermistor for precise internal temperature monitoring.
  • Features high creepage and clearance distances with a CTI greater than 400 for enhanced insulation safety.

Applications

  • High-frequency switching applications
  • Medical equipment applications

Procurement Notes

Verify component authenticity through official Infineon channels or authorized distributors. Confirm that the specific BOSA1 suffix matches the required packaging configuration. Ensure all technical specifications align with the target application requirements before finalizing orders.

Selection Notes

Select this module for designs requiring low switching losses and high frequency operation. Consider the 1200 V rating and 600 A current capacity against system demands. Evaluate the thermal resistance values to ensure adequate heatsinking for the intended duty cycle.

Part Context

This component belongs to the TRENCHSTOP IGBT4 family within the PrimePACK™2 series. It utilizes advanced silicon technology combined with SiC diodes to optimize performance in demanding power conversion environments while maintaining robust mechanical and electrical isolation standards.

Replacement Considerations

Consult official replacement guides for cross-references. Verify pinout compatibility and thermal interface dimensions when substituting similar modules from the same manufacturer's portfolio.

FF600R12IS4FBOSA1FF600R12IS4FBOSA1
$329.11
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