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The FF750R17ME7B11BPSA1 is a single IGBT module from Infineon's EconoDUAL™3 series, utilizing TRENCHSTOP™ IGBT7 technology. It features a collector-emitter voltage (VCEs) of 1700 V and a continuous DC collector current (ICDC) of 750 A at 25°C junction temperature. The maximum repetitive peak collector current (ICRM) reaches 1500 A. The module incorporates an integrated NTC thermistor with a rated resistance of 5 kΩ at 25°C. Mechanical assembly utilizes PressFIT contact technology, and the unit weighs approximately 345 g.
Verify component authenticity by cross-referencing the Data Matrix barcode on the module label against official Infineon records. Confirm that the specific ordering suffix matches the required technical specifications. Ensure compliance with industrial qualification standards such as IEC 60747 and IEC 60068 prior to integration into final equipment designs.
Select this module for applications requiring high current density and robust short-circuit withstand capability up to 2600 A. Verify gate driver compatibility using the Infineon Gate Driver Finder tool. Ensure thermal interface material application adheres to the restricted area guidelines specified in the package outline drawings to maintain optimal thermal resistance values.
This component belongs to the EconoDUAL™3 product family designed for medium to high power industrial applications. It represents the seventh generation of TRENCHSTOP™ IGBT technology, offering improved switching characteristics compared to previous generations. The module is specifically engineered for industrial environments requiring high reliability and compact form factors.
Direct pin-to-pin replacements within the same voltage and current rating may include other variants from the EconoDUAL™3 series. Verify mechanical dimensions and terminal configurations before substitution. Consult official Infineon documentation for detailed cross-reference information regarding alternative part numbers.
The module supports an operating junction temperature range from -40°C to 175°C. Operation above 150°C is permitted only under overload conditions.
The module uses PressFIT contact technology, allowing it to be directly inserted into plated-through holes on the PCB without soldering the main terminals.
At a forward current of 750 A and 25°C junction temperature, the typical forward voltage (VF) is 2.35 V, with a maximum of 2.50 V.