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FF8MR12W1M1HC58BPSA1 is listed in the FET, MOSFET Arrays range at ChipApex. The manufacturer field lists Infineon Technologies. Its product description is EASY STANDARD. Review the specifications below when checking this part for your BOM.
FET, MOSFET Arrays specifications for FF8MR12W1M1HC58BPSA1
- Description：EASY STANDARD
- Series：-
- Mfr：Infineon Technologies
- Package：Tray
- Technology：-
- Configuration：-
- FET Feature：-
- Drain to Source Voltage (Vdss)：-
- Current - Continuous Drain (Id) @ 25°C：-
- Rds On (Max) @ Id, Vgs：-
- Vgs(th) (Max) @ Id：-
- Gate Charge (Qg) (Max) @ Vgs：-
- Input Capacitance (Ciss) (Max) @ Vds：-
- Power - Max：-
- Operating Temperature：-
- Mounting Type：-
- Package / Case：-
- Supplier Device Package：-
- Grade：-
- Qualification：-
FET, MOSFET Arrays datasheet and documents for FF8MR12W1M1HC58BPSA1
FET, MOSFET Arrays Overview
The FF8MR12W1M1HC58BPSA1 is a CoolSiC MOSFET half-bridge module from Infineon Technologies, utilizing silicon carbide technology. It features a 1200 V drain-source voltage rating and operates within a junction temperature range of -40°C to 175°C. The device employs the EasyDUAL™ 1B package configuration for efficient thermal management and mounting.
FET, MOSFET Arrays Feature Summary
- Integrates high-performance CoolSiC MOSFETs in a compact half-bridge topology
- Optimized for high-frequency switching applications with low switching losses
- Utilizes EasyDUAL packaging for robust mechanical stability and thermal performance
FET, MOSFET Arrays Applications
- High-efficiency DC-DC converters
- Industrial motor drives
- Uninterruptible power supplies (UPS)
FET, MOSFET Arrays Procurement Notes
Verify the specific suffix C58 against official datasheets to confirm pinout and electrical characteristics. Ensure compatibility with recommended gate driver circuits and thermal interface materials. Confirm RoHS compliance status through manufacturer documentation prior to integration.
FET, MOSFET Arrays Selection Notes
Select this component for designs requiring high voltage isolation and superior thermal efficiency compared to silicon alternatives. Evaluate the trade-off between switching speed and electromagnetic interference. Ensure system layout supports the specific thermal requirements of the EasyDUAL package form factor.
FET, MOSFET Arrays Part Context
This module belongs to the CoolSiC family, representing a shift towards wide-bandgap semiconductor solutions. It complements other EasyDUAL variants by offering enhanced power density. The product line targets next-generation power electronics demanding higher efficiency and reduced system size.
FET, MOSFET Arrays Replacement Considerations
Consult official substitution lists for compatible half-bridge modules. Verify that alternative parts match the 1200V rating and EasyDUAL footprint. Cross-reference switching parameters to ensure circuit stability during transition.
Explore related parts through FETs, MOSFETs, Transistors, Discrete Semiconductor Products, all product categories.
