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Product Detailed Parameters
- Description：IGBT MOD 1200V 900A 20MW
- Series：PrimePACK™2
- Mfr：Infineon Technologies
- Package：Tray
- IGBT Type：Trench Field Stop
- Configuration：Half Bridge
- Vce(on) (Max) @ Vge, Ic：2.1V @ 15V, 900A
- Input：Standard
- NTC Thermistor：Yes
- Operating Temperature：-40°C ~ 150°C
- Mounting Type：Chassis Mount
- Package / Case：Module
- Supplier Device Package：Module
- Voltage - Collector Emitter Breakdown (Max)：1200 V
- Current - Collector (Ic) (Max)：900 A
- Power - Max：-
- Current - Collector Cutoff (Max)：5 mA
- Input Capacitance (Cies) @ Vce：54 nF @ 25 V
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Overview
The FF900R12IE4PBOSA1 is a half-bridge IGBT module from Infineon Technologies, utilizing Trench/Fieldstop IGBT4 technology and an Emitter Controlled Diode. It features a PrimePACK™2 housing with pre-applied thermal interface material. Key electrical parameters include a collector-emitter voltage (VCES) of 1200 V, a continuous DC collector current (IC nom) of 900 A at TH = 60°C, and a repetitive peak collector current (ICRM) of 1800 A. The saturation voltage (VCEsat) ranges from 1.75 V to 2.50 V depending on junction temperature. Thermal resistance from junction to heatsink is 48.1 K/kW for the IGBT and 87.2 K/kW for the diode.
Feature Summary
- High short-circuit capability and surge current robustness
- Low switching losses with positive temperature coefficient for VCEsat
- Integrated NTC temperature sensor for monitoring
- 4 kV AC insulation strength with high creepage and clearance distances
Applications
- High power converters
- Motor drives
- Wind turbines
Procurement Notes
Verify component authenticity by checking the UL approval mark (E83335) and RoHS compliance status. Confirm the presence of the pre-applied thermal interface material and ensure proper storage conditions are maintained according to application notes. Validate terminal torque specifications during installation to maintain reliable electrical connections.
Selection Notes
Select this module for applications requiring high current density and robust short-circuit withstand capability. Ensure the cooling system can handle the specified thermal resistance values. Verify that the gate drive circuitry supports the required ±15 V operation and internal gate resistor characteristics for optimal switching performance.
Part Context
This component belongs to the PrimePACK™2 series, designed for industrial applications. It integrates fourth-generation trench field-stop IGBTs with emitter-controlled diodes. The module provides a compact solution with high power density, suitable for demanding environments where reliability and efficiency are critical.
Replacement Considerations
FF900R12IE4P
FAQ
What is the maximum baseplate operating temperature?
The maximum baseplate operating temperature (TBPmax) is 125 °C.
Does the module include an integrated temperature sensor?
Yes, the module includes an integrated NTC temperature sensor with a rated resistance of 5.00 kΩ at 25 °C.
What is the stray inductance of the module?
The module stray inductance (LsCE) is typically 18 nH.
