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The FFB2222A is an NPN multi-chip general-purpose amplifier manufactured by onsemi. It integrates four discrete transistors within a single SC70-6 surface-mount package. The device supports continuous collector currents up to 500 mA and features a collector-emitter breakdown voltage of 45 V, with a maximum power dissipation of 300 mW at 25°C ambient temperature. Key electrical characteristics include a DC current gain (hFE) ranging from 35 to 300 depending on operating conditions, a transition frequency (fT) of 300 MHz, and a junction-to-ambient thermal resistance of 415 °C/W.
Verify the specific ordering suffix and tape-and-reel packing method when sourcing components. Confirm that the SC70-6 package dimensions align with the target PCB land pattern requirements. Ensure compliance with RoHS directives as specified in the manufacturer documentation before finalizing procurement orders.
Select this component for designs requiring multiple NPN switches or amplifiers in a minimal footprint. Evaluate the 300 mW total power dissipation limit against the expected thermal load. Consider the 415 °C/W thermal resistance for heat management strategies in dense layouts.
This part belongs to the FFB2222A/FMB2222A/MMPQ2222A family of NPN multi-chip general-purpose amplifiers. While functionally similar across the series, the FFB2222A specifically utilizes the SC70-6 package, distinguishing it from the SSOT-6 and SOIC-16 variants available in the same product line.
FMB2222A and MMPQ2222A are confirmed functional equivalents within the same datasheet. Verify pinout compatibility and package dimensions before substitution.