FGA15S125P

FGA15S125P

  • Description:IGBT TRENCH 1250V 30A TO-3P
  • Series:-

SKU:051a8f58134c Category: Brand:

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Product Detailed Parameters

  • Description:IGBT TRENCH 1250V 30A TO-3P
  • Series:-
  • Mfr:onsemi
  • Package:Tube
  • IGBT Type:Trench
  • Voltage - Collector Emitter Breakdown (Max):1250 V
  • Current - Collector (Ic) (Max):30 A
  • Current - Collector Pulsed (Icm):45 A
  • Vce(on) (Max) @ Vge, Ic:2.72V @ 15V, 15A
  • Power - Max:136 W
  • Switching Energy:-
  • Input Type:Standard
  • Gate Charge:129 nC
  • Td (on/off) @ 25°C:-
  • Test Condition:-
  • Reverse Recovery Time (trr):-
  • Operating Temperature:-55°C ~ 175°C (TJ)
  • Mounting Type:Through Hole
  • Package / Case:TO-3P-3, SC-65-3
  • Supplier Device Package:TO-3P
  • Grade:-
  • Qualification:-

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FGA15S125P

Overview

The FGA15S170P is a 1250 V, 30 A shorted-anode IGBT from onsemi’s EliteSiC family. It utilizes advanced field-stop trench and shorted-anode technology to deliver superior conduction and switching performance. The device features a TO-3PN package and supports parallel operation with robust avalanche capability. Designed for high-efficiency industrial applications, it offers reliable power switching in demanding environments.

Feature Summary

  • Advanced field-stop trench and shorted-anode technology for optimized performance
  • Robust avalanche rating suitable for harsh operating conditions
  • Capable of parallel configuration for higher current applications

Applications

  • Industrial motor drives
  • High-power switching applications
  • Energy infrastructure systems

Procurement Notes

Verify the exact part number suffix against official datasheets to confirm specific thermal or electrical variants. Ensure compatibility with existing gate drive requirements and thermal management solutions. Cross-reference manufacturer documentation for latest revision status and recommended operating conditions before integration.

Selection Notes

Select this component for applications requiring high voltage blocking and efficient switching at moderate currents. Consider its avalanche ruggedness for systems prone to transient overvoltages. Evaluate thermal resistance parameters for heatsink design. Confirm package compatibility with PCB layout constraints and mounting hardware specifications.

Part Context

This IGBT belongs to onsemi’s portfolio of intelligent power solutions. It complements other discrete power devices like MOSFETs and SiC diodes within the company’s broader energy conversion offerings. The device supports system-level efficiency improvements in industrial and renewable energy sectors through advanced semiconductor architecture.

Replacement Considerations

Consult official substitution guides for direct equivalents. Verify pinout compatibility and electrical parameter margins when considering alternative manufacturers. Ensure thermal characteristics match existing cooling designs to maintain reliability standards.

FGA15S125PFGA15S125P

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