SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
The onsemi FGD3440G2-F085V is a single N-channel Insulated Gate Bipolar Transistor (IGBT) from the ECOSPEED™ family, designed for high-efficiency power switching. It features a maximum collector-emitter voltage of 300 V and a continuous collector current of 26.9 A at 25°C. The device utilizes a DPAK (TO-252) surface-mount package with dimensions of 6.73 x 6.22 x 2.39 mm. Key electrical parameters include a maximum power dissipation of 166 W, a gate-emitter voltage range of ±10 V, and a switching speed of 1 MHz. It operates within a temperature range of -40 °C to +175 °C and holds AEC-Q100 automotive qualification.
Verify the specific suffix 'V' against official datasheets to confirm if it denotes a specific tape-and-reel variant or packaging option distinct from standard tube configurations. Confirm RoHS compliance status and ensure the supplier provides traceable documentation matching the manufacturer's part identification. Cross-reference the ordering code with authorized distributors to avoid counterfeit components.
Select this component for applications requiring a balance of high current handling and fast switching speeds in a compact surface-mount form factor. Ensure the design accounts for the 166 W power dissipation limit and adequate heatsinking for the DPAK package. Verify that the 300 V rating exceeds the system's peak voltage requirements and that the gate drive circuit supports the specified ±10 V limits.
This IGBT belongs to onsemi's ECOSPEED™ series, which focuses on reducing conduction and switching losses. The FGD3440G2 variant specifically targets 300 V applications, offering improved figure-of-merit compared to previous generations. The F085 suffix typically indicates specific internal cell design or testing criteria defined by the manufacturer for consistency across production batches.
Direct replacements must match the 300 V / 26.9 A specification and DPAK footprint. Check alternative manufacturers like Infineon or Mitsubishi for equivalent ECOSPEED-class devices. Ensure pinout compatibility and verify that thermal resistance values are comparable to maintain existing cooling solutions.