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The onsemi FGH40N60SFDTU-F085 is a Field Stop N-channel IGBT housed in a TO-247 package. It features a maximum collector-emitter voltage (VCEO) of 600 V and a continuous collector current (Ic) of 40 A, with a peak pulsed current rating of 80 A. The device exhibits a low saturation voltage (VCEsat) of 2.3 V at 40 A and a gate-emitter threshold voltage of 6 V. Key switching parameters include a turn-on delay time of 25 ns and a fall time of 17 ns. Maximum power dissipation is rated at 290 W, with an operating temperature range from -55°C to +150°C.
Verify the specific suffix F085 against official datasheets to confirm packaging details, as ordering codes may indicate tube quantities or specific manufacturing lot requirements. Ensure compatibility with existing thermal management solutions given the 290 W dissipation rating. Cross-reference RoHS and REACH compliance status directly with the manufacturer's latest documentation before finalizing procurement orders.
Select this component when a 600 V blocking capability and 40 A continuous current are required in a through-hole TO-247 form factor. The Field Stop architecture offers superior trade-offs between conduction loss and switching speed compared to standard trench technologies. Consider thermal resistance limits and gate drive voltage compatibility, specifically the ±20 V maximum rating, during circuit design integration.
This part belongs to onsemi’s Field Stop IGBT family, designed for robust performance in demanding power conversion environments. The FGH series utilizes advanced epitaxial layer engineering to reduce tail current effects. As an automotive-qualified device, it meets stringent reliability standards required for electric vehicle and industrial control applications, ensuring long-term operational stability under varying thermal conditions.
Direct substitutes within the same voltage and current class include the FGH40N60SMD variant, though package and exact electrical tolerances must be verified. Other compatible options from the FGH40N60SFDTU lineup should be evaluated based on specific switching speed requirements and thermal interface compatibility.